COOLTHERM 6733

Harmonization Code : 3910.00.00.90 | Silicones in Primary Forms; Others

COOLTHERM 6733

Main features

  • Solvent-Free RTV Silicone Encapsulation
  • Low-Stress No-Exotherm Room-Temperature Cure
  • -60 to 205 deg C Continuous Service

Product Description

CoolTherm® Circalok 6733 Silicone System is the hardener component used with Circalok® 6716 Silicone Resin to create a two-component, solvent-free RTV silicone encapsulant system for potting and encapsulating low- and high-voltage electrical and electronic assemblies. The cured system provides low stress, excellent dielectric properties, room-temperature curing without hardener poisoning, and cures without exotherm, making it suitable for protecting sensitive electronic components.

Key Features

  • Forms a two-component solvent-free RTV silicone encapsulant with Circalok® 6716 Resin.
  • Room-temperature curing formulation that is not subject to hardener poisoning.
  • Low-shrinkage, low-stress cure helps protect sensitive electronic assemblies.
  • Cures without exotherm, including deep-section encapsulations.
  • Provides excellent dielectric strength and electrical resistivity after cure.
  • Supports continuous operating temperatures from -60°C to +205°C.

Suitable For

  • Potting electrical assemblies
  • Encapsulating electronic assemblies
  • Low-voltage electronics
  • High-voltage electronic assemblies
Product Family

COOLTHERM 6733

Catalog Product

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Technical Specifications

General Properties
Mix RatioMix Ratio
100:2.5

Additional Information

As-Supplied / Before-Processing Properties

Property Value
Compatible Resin Circalok® 6716 Silicone Resin
Mix Ratio (Resin : Hardener) 100 : 2.5 by weight
Working Life 45 minutes @ 25°C
Cure Time 12–16 hours @ 25°C
Shelf Life 6 months at 25°C in the original unopened container

After-Processing / Final-State Properties

Property Value
Thermal Conductivity 0.3 W/m·K (ISO 22007-2)
Coefficient of Thermal Expansion 110 ppm/°C
Hardness Shore A 45
Tensile Strength 0.97 MPa (140 psi)
Elongation at Break 200%
Volume Resistivity 1 × 1015 ohm·cm
Dielectric Strength 19.7 kV/mm (500 V/mil) (ASTM D149)
Dielectric Constant 3.5 @ 25°C (ASTM D150)
Dissipation Factor 0.01 @ 25°C (ASTM D150)

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