Additives
Performance Enhancing Additives
Additives
Additives are specialty chemicals that are added to base-chemistries to improve performance. These additives are often blended into the epoxy molding compounds, silicones, epoxy coating powders and other polymers to improve some aspect of performance. KRAYDEN offers a range of specialty additives to be used in our own chemistries or they can be used to improve the performance of your own materials.
76 products

INSULCURE 11B
- Heat-Curing INSULCAST Epoxy Curing Agent
- 700 cP Application Viscosity
- 3-Hour 100 deg C Cure


COOLTHERM SC-6730
- Room-Temperature Thick-Section Cure
- 3.0 to 10.0% Mix Concentration
- Blue-Green Visual Mix Indicator


LORD 3135-B
- Former Lord 7111-B Hardener
- Low-Shrinkage Epoxy Bonding
- Room-Temperature or Accelerated Heat Curing


DOWSIL 3-6559
- Adjustable 1 to 5 Wt% Addition Level
- 4 to 12-Hour Cure Window
- Surface/Environment Cure-Inhibition Management


BONDERITE C-IC DEOXIDOZER
- Aluminum Deoxidizing, Desmutting, Etching
- Prepares for Chromating
- 1 to 10 Minute Application Rate

MM220 | Mono-acrylate monomer
- Low Viscosity
- Low weight loss on cure
- Minimizes cure shrinkage


LOCTITE UK3184
- UK 3173 System Hardener
- 45-Minute System Work Time
- 24-Hour Room-Temperature Cure

A1050 | Anti bleed Additive
- Silver filled systems
- 100 mPa-s Viscosity
- Non halogenated


DOWSIL FS1265
- 100% Active Fluorosilicone Foam Control
- Chlorinated-Solvent-Insoluble Foam-Control Formulation
- 300/1,000/10,000 mm^2/s Viscosity Grades


ENTHONE 20/A
- Two-Hour Mixed-Ink Pot Life
- Ambient or Heat Cure
- Permanent Marking Application Flexibility


ENTHONE 45
- M- and 50-Series Compatibility
- Catalyst-Selected Cure Control
- Permanent Marking System Integration


ENTHONE 77
- Ambient or Heat-Cure Choice
- One-Hour Ink Pot Life
- Heat-Enhanced Adhesion Development


ENTHONE AD2003
- Extended Marking-Ink Open Time
- Incremental 3 to 6% Addition
- In-Process Machine-Marking Adjustment


DOWSIL Q2-1346
- Low Sodium and Potassium Impurity Limits
- Clear Liquid Supplied Free from Suspended Matter
- Long 900-Day Shelf Life


ENTHONE AD3002
- Two to Four Percent Flow Adjustment
- Crawling and Pinholing Control
- Gentle Post-Induction Mixing


ENTHONE B13/28
- Accelerated Three-Day Ambient Cure
- One-Hour Processing Window
- Nonconductive Black Ink Compatibility


ENTHONE B3
- Four-Hour Ink Pot Life
- Controlled Heat-Cure Processing
- Faster Cure at Higher Temperature

A6165 | Electrical conductivity Enhancer
- Improves electrical conductivity
- Soluble in most resin systems
- May improve thermal conductivity


BONDRITE C-AK MIL-ETCH
- Fine Satin or Frosted Etch on Aluminum
- Low-Foam Alkaline Formulation
- Scale- and Sludge-Reducing Sequestering Chemistry

CS-783 | Methacrylated Epoxy Functional Hybrid Cyclosiloxane
- Low viscosity
- Dual cure mechanism
- Multifunctional



U-847 | Dimer Diisocyanate Urethane Dimethacrylate
- Low color
- Low cure shrinkage
- BPA-free


DOW XR-1541
- E-Beam Patternable, Negative Tone
- Etch Resistance Surface Treatment
- High Purity Surface Treatment


BONDERITE C-AK 4316
- Heat-Scale Conditioning for Multiple Alloys
- Lower-Temperature Molten-Salt Bath Processing
- Nonflammable Titration-Controlled Bath Maintenance


LOCTITE CAT 14
- Powdered Anhydride Epoxy Hardener
- Long Epoxy Working Life
- 3-Hour Cure at 150 deg C

PEM-665 | Methacrylate terminated polyester
- Low color
- Low shrinkage
- Thermal stability


LOCTITE CAT 15
- Liquid Polyamide Epoxy Hardener
- Two-Hour Pot Life
- 80 deg C Accelerated Cure


LOCTITE CAT 15 LV
- Low-Viscosity Epoxy Hardener
- 120-Minute Working Time
- Rigid/Semi-Rigid/Flexible Epoxy Systems


LOCTITE CAT 17M-1
- Anhydride-Based Epoxy Hardener
- Non-Flammable Curing Agent
- Electronic/Industrial Resin Systems


LOCTITE CAT 21
- Low-Viscosity Polyoxyalkylene Amine Curative
- One-Hour Pot Life
- Large-Mass Epoxy Castings


LOCTITE CAT 23LV
- Low-Viscosity Polyamine Epoxy Catalyst
- Water-Soluble Curing Agent
- Low-VOC Amber Liquid


LOCTITE CAT 24LV
- Low-Viscosity Epoxy Curing Agent
- Long Epoxy Pot Life
- Low-Temperature Cured Epoxy Performance


LOCTITE CAT 27-1
- Low-CTE Cured Epoxy
- Two-Hour Working Time
- Chemical-Resistant Cured Epoxy


LOCTITE CAT 43
- Liquid Polyamine Epoxy Catalyst
- Chemical-Resistant Cured Systems
- LOCTITE Encapsulant Compatibility


LOCTITE CAT 50-2
- Low-Viscosity Liquid Catalyst
- Dibutyltin Dilaurate Chemistry
- Consistent Catalytic Activity


LOCTITE CAT B97
- Low/Medium-Viscosity Epoxy Catalyst
- Encapsulation and Potting Systems
- Adhesion and Electrical Insulation


LOCTITE CAT9
- Modified Aliphatic Amine Hardener
- Chemical-Resistant Cured Epoxy
- -40 to 130 deg C Service

CONAP DS-1832
- Black Epoxy/Polyurethane Color Concentrate
- 18% Heat-Stable Black Pigment
- Filled/Unfilled Resin Addition Ranges

CONAP DS-1833
- Blue Epoxy/Polyurethane Color Concentrate
- 50% Heat-Stable Blue Pigment
- Filled/Unfilled Resin Addition Ranges

Benzimidazole CAS #51-17-2
- Enhanced Thermal Stability
- Versatile Chemical Base
- Corrosion Protection


BONDERITE M-ED 1000
- Nickel Acetate-Based Sealing Process
- Reduced Smut, Powdering, and Yellowing
- Commercial and Selected Military Anodizing Seal Processes


BONDERITE L-AD 42
- Organosilicone Surfactant Foam Control
- Free-Rinsing Low-Residue Chemistry
- Polymer, Adhesive, and Latex Foam Control


BONDERITE S-AD 103
- Acid-Bath Corrosion Inhibition
- Direct Liquid Addition to Acid Baths
- Industrial Metal-Cleaning Bath Support

BOSTIK NSBT-16
- Copper-Graphite Anti-Seize Protection
- Up to 1800 deg F
- Brush-Top Assembly Application

BOSTIK NSBT-16N
- Copper-Free High-Temperature Protection
- Seizure and Galling Control
- Aggressive-Service Assembly Lubrication

EPIBOND 1210
- Low-Outgassing Epoxy Bonding
- 50 to 75-Minute Working Window
- Flexible Cured Adhesive

BOSTIK NSBT-8N
- Copper-Free Pure-Nickel Protection
- Severe-Service Assembly Protection
- Compact 8 oz Package

BOSTIK BOSCODUR
- Solvent-Resistant Urethane Bonding
- Effective Cross-Linker for Nitrile
- 4 to 6-Hour Working Window

CONAP DS-1831A
- 15% Red Pigment Concentrate
- Epoxy and Polyurethane System Compatibility
- Filled and Unfilled Formulation Guidance

MM304 | Methacrylate adhesion promoter Additive
- Mild pleasant odor
- Hydrolytic resistance
- Lower weight loss on cure than IBOMA


COOLTHERM EP-6252
- Defined Epoxy Hardener Component
- Electrical Encapsulation System Use
- Component-Level Metering Control


COOLTHERM 6250
- 350 cP Low-Viscosity Curing Agent
- High-Solids Adhesive/Encapsulation Curing Agent
- Chemical-Resistant Cured Epoxy Systems


COOLTHERM 6732
- Hardener Component Thermal Interface Material
- 100:0.5 Controlled Mixing
- Thermally Conductive Thermal Interface


COOLTHERM 6733
- Solvent-Free RTV Silicone Encapsulation
- Low-Stress No-Exotherm Room-Temperature Cure
- -60 to 205 deg C Continuous Service

ARALDITE TDR 1100-11
- Glass, Plastic, and Wood Bonding
- 2:1 Meter-Mix Processing
- 90-Minute Working Window

HARDENER HW 8680
- 225% Cured Elongation
- Polycarbonate, Nylon, and Primed-Metal Bonding
- 1:1 Mix with 15-Minute Open Time

HARDENER HY 5049
- High-Strength Structural Bonding
- Documented Water/Ice/Tropical-Climate Resistance
- Transparent Cured Bondline


COOLTHERM EP-6010
- 55 cP Application Viscosity
- Low-Shrinkage Epoxy Curing Agent
- Two-Year Shelf Life at 25 deg C


LORD 304-2
- High-Viscosity Placement Control
- Rubber, Wood, and FRP Bonding
- Durable Cured Performance with Environmental


LORD 306-2
- 306-1 Epoxy Hardener
- 1 to 2-Hour Working Time
- 24 to 48-Hour Room-Temperature Cure

A1100 | Anti bleed Additive
- 0.5%-1% wt
- Metal surfaces
- Excellent bleed control

A304 | 4-META adhesion promoter Additive
- Dental Applications
- Adhesion promoter
- Methacryloxyethyl trimellitic anhydride

A478-M | PMDM-M adhesion promoter Additive
- Dental Applications
- Adhesion promoter
- Pyromellitic Dianhydride Dimethacrylate

A6225| Anti bleed Additive
- Universal additive
- Reduces bleed out on metal surfaces
- Non halogenated

A6280 | Anti bleed Additive
- Use in Non-metal-filled systems
- Excellent bleed control on Gold surfaces
- Non halogenated

A675-100 | PMDGM adhesion promoter Additive
- Versatile
- Adhesion promoter
- Pyromellitic Dianhydride Glycerol Dimethacrylate Adduct
Chemlinq AL20-2B | Triethylenetetramine (TETA)
- Epoxy crosslinking hardener
- Soluble in polar solvents
- Colorless

CS-697 | Polyglycidyl Ether Cyclosiloxane
- Low viscosity
- Compatible with organic resins
- For formulating adhesives

Dow Corning Toray SF-8421-EG Fluid
- Epoxy Mold Compound (EMC) additive
- Formulated for compatibility with EMC
- Internal release agent for EMC

MM-204 High Tg Mono-Functional Acrylate Monomer
- Hydrolytically resistant
- Low Viscosity
- High Glass Transition Temperature (Tg)
Starts at€180.72

MM211 | Maleimide adhesion promoter Additive
- Adhesion promoter
- Flexible aliphatic backbone
- Maleimide and carboxylic groups

MM281 | Maleimide adhesion promoter Additive
- Adhesion promoter
- Flexible aliphatic backbone
- Long Alkyl chain

MM290| Acrylate adhesion promoter Additive
- Mild pleasant odor
- Hydrolytic resistance
- Lower weight loss on cure than IBOA

PEAM-1044 Low warpage Polyester Acrylate/Methacrylate
- Thermally stable
- Low warpage
- High adhesion to various substrates

PEAM-1769 Difunctional (meth)acrylate
- Ultra low modulus
- Thermal stability
- High adhesion to various substrates
Starts at€209.04

PEAM-645 High Tg Polyester Acrylate/Methacrylate
- High Tg
- Low CTE
- High adhesion to various substrates
Starts at€246.02
Product selector guide
Anti-bleed Additive
| Product | Chemistry/Description | Application/Features |
| A1050 | Antibleed Additive | Non halogenated |
Superior compatibility with metal filler systems such as silver. Improved bleeding properties: Non-metal filled systems ex. silica |
| A1100 | Antibleed Additive | Non halogenated | Designed for metal surfaces with more acid functionality. Improved bleeding properties: Non-metal filled systems ex. silica Recommended formulation: 0.5% - 1.0% |
| A6225 | Antibleed Additive | Non halogenated | Universal additive | Excellent compatibility: Silver Improved bleeding properties: Non-metal filled systems ex. silica It also provide mold release and surface atnti stiction properties. Recommended formulation: 2% - 4% |
| A6280 | Antibleed Additive | Non halogenated |
Excellent compatibility: Gold surfaces Designed for Non-metal filled systems Minimal or no affect on the adhesion properties of the formulation.Recommended formulation: 0.5% - 1.0% |
| A6165 | Electrical Conductivity Enhancer |
Use as an additive in combination with metal fillers (e.g. silver or Ag coated Cu) to further |
Adhesion Promoter Additive
| Product | Chemistry/Description | Application/Features |
| A304 | 4-Meta (Methacryloxyethyl trimellitic anhydride) Adhesion Promoter Additive |
Reactive Primer specific for dental application Enhance monomer penetration into dentin pretreated with 10% citric acid and 3% ferric chloride |
| A478-M | PMDM-M (Pyromellitic Dianhydride Dimethacrylate) Adhesion Promoter Additive | PMDM-M chemistry is a cheaper option for dental adhesive application |
| A675-100 | PMDGM (Pyromellitic Dianhydride Glycerol Dimethacrylate Adduct) Adhesion Promoter Additive | Adhesion enhancement where four methacrylate groups and two carboxylic groups per molecule allow bonding to a variety surfaces. |
| MM211 | Maleimide Adhesion Promoter Additive | Flexible Aliphatic backbone | Use as intermediate for the synthesis of ester and amide linked thermoset monomers, as well as maleimide functional resins |
| MM281 | Maleimide Adhesion Promoter Additive | Flexible Aliphatic backbone | Long Aklyl Chain | Main difference from MM211 is the twice as long alkyl chain |
| MM290 | Acrylate Adhesion Promoter | Use in UV or peroxide cure formulations and applications that require hydrolytic resistance | Mild odor |
| MM304 | Methacrylate adhesion promoter Additive | Use as a reactive diluent monomer for use in UV or peroxide cure formulations. |
Base Resin
| Product | Chemistry/Description | Application/Features |
| PEAM-1044 | Low warpage Polyester Acrylate/Methacrylate | High thermal stability and low volatility | Use as a base resin in a formulation or an additive | Exceptionally low warpage with the addition of polybutadiene type resins |
| PEAM-1769 | Difunctional (meth)acrylate | Use as a base resin or an additive to reduce stress | Excellent adhesion on most substrates with low stress and low shrinkage due to its high Tg polycyclic repeat units. |
| PEAM-645 | High Tg Polyester Acrylate/Methacrylate | Use as a base resin in adhesive applications or coating applications | Exhibits low CTE, high Tg, and high modulus. |
| PEM-665 | Methacrylate terminated polyester | Use as a base resin in dental applications | Good solubility in both aliphatic and aromatic co-monomers. |
Universal Additive
| Product | Chemistry/Description | Application/Features |
| Benzimidazole | Benzimidazole | Latent curing Agent For Epoxy Resins | Reacts at elevated temperatures makes it ideal for enhancing the thermal stability and mechanical properties of epoxy mold compounds. |
| CHEMLINQ AL20-2B | Triethylenetetramine (TETA) | Corrosion Inhibitor | Accelerate Curing Process | Fuel Additive | Premier epoxy curing agent that accelerates the curing process and can produce durable coatings in adhesives, composites, and coatings |
| CS-697 | Polyglycidyl Ether Cyclosiloxane | For Adhesive formulation base resin with compatibility with most organic resins. |
| CS-783 | Methacrylated, Epoxy-functional Hybrid Cyclosiloxane Monomer Adhesion Enhancer Additive | Used primarily as an adhesion promoter for mold compounds, metal surfaces, and polyimides by improving interfacial bonding |
| Dow Corning Toray SF-8421 | EG Fluid | EMC Internal Release Agent Additive | Formulated for compatibility with EMC wherein the main purpose is to reduce stress and improve flowability of the mold compound | Excellent compatibility with epoxies and silicones |
| MM204 | High Tg Mono-Functional Acrylate Monomer | Use as a reactive diluent for UV or peroxide cured resins, coatings or adhesives | Improve stereolithographic processes for high-temperature applications. |
| MM220 | Low viscosity mono-acrylate monomer | Use as reactive diluent for UV or peroxide cured resins, coatings and adhesives | Polycyclic ring structure helps minimize shrinkage on cure |
| U-847 | high-purity, methacrylate-modified urethane monomeR | Use in advanced light-cure formulations | No BPA backbone |





















