LOCTITE SI 5210
Harmonization Code : 3910.00.00.90 | Silicones in Primary Forms; Others
Main features
- Ultra-Fast RTV Silicone Cure
- Non-Corrosive Alkoxy-Cure Potting
- Thixotropic Non-Sag Application
Product Description
LOCTITE® SI 5210™ is an ultra-fast curing, non-corrosive RTV alkoxy silicone formulated for potting, wire tacking, selective sealing, vibration damping, and repair or rework applications on printed circuit boards and electronic assemblies. The thixotropic, non-sag formulation minimizes migration after application while providing rapid surface cure for high-volume manufacturing environments. It delivers excellent environmental resistance, flexibility, and electrical insulation performance for demanding industrial and electronics applications. Based on the uploaded datasheet image.
Key Features & Benefits
- Ultra-fast curing RTV silicone formulation.
- Non-corrosive alkoxy cure system.
- Thixotropic paste minimizes material migration.
- Suitable for potting, sealing and wire tacking.
- Excellent vibration damping properties.
- Rapid handling strength after dispensing.
- Designed for high-volume electronics manufacturing.
- Excellent environmental resistance.
Recommended Applications
- PCB potting and protection.
- Wire tacking applications.
- Selective electronic sealing.
- Vibration damping assemblies.
- Repair and rework operations.
- Automotive electronics protection.
TDS, SDS & Technical Documents
Technical Specifications
General Properties
AppearanceAppearance
Translucent to opaque, slightly yellow to straw color pasteSpecific GravitySpecific Gravity
1.05Additional Information
Technical Properties
As-Supplied / Before-Processing Properties
| Property | Value | Unit | Condition |
|---|---|---|---|
| Technology | Silicone | — | RTV potting compound |
| Chemical Type | Alkoxy Silicone | — | Non-corrosive cure system |
| Appearance | Translucent to Opaque, Slightly Yellow to Straw Paste | — | Uncured material |
| Components | One Component | — | No mixing required |
| Viscosity | Thixotropic Paste | — | Non-sag formulation |
| Specific Gravity | 1.05 | — | 25°C |
| Extrusion Rate | 100 - 700 | g/min | 0.62 MPa, 25°C, 1/8 in nozzle |
| Tack-Free Time | ≤5 | minutes | 22°C / 50% RH |
| Depth of Cure | 2.0 | mm | After 4 hours |
| Depth of Cure | 3.4 | mm | After 16 hours |
Technical Properties
After-Processing / Final-State Properties
| Property | Value | Unit | Condition / Method |
|---|---|---|---|
| Shore Hardness | 48 | Shore A | ISO 868, cured 1 week |
| Water Vapor Transmission Rate | 5.2 | g/(h·m²) | Typical cured value |
| Water Absorption | 0.87 | % | 24 h immersion at room temperature |
| Glass Transition Temperature | -52 | °C | Typical cured value |
| Coefficient of Thermal Expansion | 255 | µm/m·K | Typical cured value |
| Elongation at Break | 230 | % | Typical cured value |
| Tensile Strength | 2.8 | N/mm² | Typical cured value |
| Tear Strength | 9.5 | N/mm | ISO 34-1 |
| Dielectric Breakdown Strength | 20.1 | kV/mm | IEC 60243-1 |
| Volume Resistivity | 8.2 × 10¹⁴ | Ω·cm | IEC 60093 |
| Lap Shear Strength (Aluminum) | 1.3 | N/mm² | ISO 4587, cured 1 week |
