Potting Materials

Epoxy, Urethane, Silicone and Acrylic materials

Potting materials

Potting compounds are versatile materials designed to protect electronic assemblies from environmental hazards and mechanical stress. These compounds effectively shield circuit boards and electronic components from moisture, vibration, thermal fluctuations, and physical shocks, ensuring optimal performance under demanding conditions. By filling the spaces around electronic components and circuit boards, potting compounds ensure that the devices remain operational in harsh conditions, ranging from extreme temperatures to high-humidity environments. This encapsulation process also helps to improve the electrical insulation properties of the assembly, reducing the risk of short circuits and enhancing the overall reliability of the device.

Potting compounds provide reliable protection across various industries, from consumer electronics to industrial automotive and aerospace applications. The potting materials ensure the longevity and reliability of electronic systems in demanding conditions. Available in various formulations such as epoxy, urethane, silicone, and acrylic, potting compounds offer distinct properties tailored to specific application requirements.

Product selector guide

Encapsulants are designed to support efficient heat transfer through a combination of high thermal conductivity and low viscosity, allowing the material to flow more easily around components while promoting more effective heat dissipation. Beyond thermal management, these potting and encapsulation materials also help protect assemblies from dust and moisture and can contribute to vibration reduction. Two-component encapsulants are formulated to deliver minimal shrinkage during cure, along with high dielectric strength and dependable thermal conductivity.

Parker Lord Potting and Encapsulants

Product	Chemistry	Thermal Conductivity (W/m·K)	Viscosity (cP)	Density (g/cm³)
CoolTherm® SC-309	Silicone	1.0	3,600	1.7
CoolTherm SC-252	Silicone	2.5	18,000	2.9
CoolTherm SC-320	Silicone	3.2	22,000	3.1
CoolTherm SC-324	Silicone	4.0	30,000	3.2
CoolTherm EP-2000	Epoxy	1.9	1,900 *	2.7
CoolTherm EP-3500	Epoxy	3.3	8,000*	3.0
CoolTherm EP-6035	Epoxy	1.0	12,000	1.6
CoolTherm EP-340/70	Epoxy	1.5	10,000	2.2
CoolTherm UR-288	Urethane	0.4	5,000	1.37
CoolTherm UR-389	Urethane	0.7	14,000	1.5

Note: Viscosity values for CoolTherm EP-2000 and CoolTherm EP-3500 are reported at 60°C, while the other listed viscosity values are reported at 25°C.

LINQ Potting and Encapsulants

Product	Operating temperature (°C)	Thermal conductivity (W/mk)	Cure time	Hardness
PM-1211	-60 - +200	0.3	24hrs (25°C)	10-30 (Shore A)
PM-1221	-60 - +150	>0.6	36hrs (25°C)	70-100 (Shore A)
PM-1231	-40 - +90	0.3	48hrs (25°C)	80 (Shore D)
PM-1231BK	-40 - +90	0.7	48 hrs (25°C)	>80 (Shore D)
PM-2632	-	-	24hrs (25°C)	70-75 (Shore D)
PM-4911	-	-	12hrs (25°C)	-
PM-4911HV	<250	0.4	12hrs (25°C)	-
PM-PU111	-	-	96-120hrs (25°C)	85 (Shore A)
PM-PU211	40 -130	0.6	24hrs (25°C)	60-70 (Shore D)
PM-PU514	-	0.75	10-12HRS (35℃)	60-70 (Shore D)
PM-SI611	-40 - +200	>1.0	1.3 - 1.8hrs (30°C)	50-60 (Shore A)
PM-WD310	-	0.3	1 hr at 80°C	-
BS-610-2	---

Frequently asked questions

Advantages of potting materials compared to conformal coatings?

Potting compounds encapsulate the entire assembly, improving protection against shock, vibration, moisture, dust, and chemicals. They can aid heat dissipation, reduce delamination risk through direct bonding, and often simplify processing for complex assemblies.

What are the benefits of two-component potting materials?

Two-component (2K) systems keep resin and hardener separate to prevent premature reaction. Mixing starts polymerization and allows tuning via fillers/additives in the formulation (not by changing mix ratio), enabling targeted performance after cure.

What should I consider when choosing a potting material?

Match the resin to environment (temperature, moisture, chemicals), required mechanical protection, and electrical insulation. Check processing fit (viscosity, pot life, cure speed) and compliance (e.g., UL 94, RoHS/REACH).

Can I change hardness by altering the mix ratio?

No. For most PUR/epoxy/silicone encapsulants, Part A:B is fixed. Changing it risks under-cure, brittle failure, or poor insulation. Select hardness via the product grade; treat systems as fixed-ratio unless the supplier explicitly states a variable-ratio design.

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Potting Materials

Types of Potting Materials

Available in various formulations such as epoxy, urethane, silicone, and acrylic, potting compounds offer distinct properties tailored to specific application requirements. Epoxy potting compounds, renowned for their adhesive strength and high temperature resistance, provide reliable protection and adhesion across diverse substrates without the need for primers. Urethane variants offer superior flexibility, elongation, and abrasion resistance, making them ideal for applications demanding resilience and durability. Silicone potting compounds excel in extreme temperature environments, with formulations capable of operating at both extremely low and high temperatures.

Acrylic

Urethane

Silicone

Epoxy

Epoxy potting materials are widely favored for their exceptional mechanical strength and adhesion properties. They form robust bonds with various substrates, providing excellent protection against moisture, chemicals, and mechanical stresses. Epoxy-based potting compounds offer superior thermal conductivity, making them ideal for applications where heat dissipation is critical, such as power electronics. Additionally, their low coefficient of thermal expansion (CTE) ensures dimensional stability under fluctuating temperatures. These characteristics, coupled with their ease of processing and versatility, make epoxy potting materials a popular choice for a wide range of electronic and industrial applications.

Silicone

Silicone-based potting materials are renowned for their outstanding flexibility and thermal stability. These materials maintain their integrity across a broad temperature range, making them suitable for extreme environmental conditions encountered in automotive, aerospace, and outdoor applications. Silicone potting compounds exhibit excellent resistance to moisture, chemicals, and UV radiation, ensuring long-term reliability in harsh environments. Their low viscosity allows for easy dispensing and complete impregnation of complex electronic assemblies, ensuring thorough encapsulation and protection against environmental contaminants. Moreover, silicone potting materials are inherently non-conductive and exhibit good dielectric properties, making them ideal for insulating sensitive electronic components.

Potting and encapsulation for printed circuit boards

Acrylic

Acrylic-based potting materials offer a versatile solution for encapsulating electronic assemblies in challenging environments. These compounds feature fast curing times and simple processing, enabling high-throughput production with minimal downtime. Acrylic potting materials provide good adhesion to a wide range of substrates, ensuring secure encapsulation and protection against moisture, dust, and chemicals. Their low shrinkage during curing minimizes internal stresses, reducing the risk of delamination and cracking in encapsulated components. Acrylic potting materials also offer excellent electrical insulation properties, maintaining signal integrity and preventing electrical failures in sensitive electronic circuits. These characteristics make acrylic potting materials well-suited for applications such as consumer electronics, LED drivers, and renewable energy systems.

Urethane

Urethane potting materials offer a balance of mechanical strength, flexibility, and chemical resistance. These compounds provide robust protection against moisture ingress, corrosion, and mechanical impact, making them suitable for applications exposed to harsh operating conditions. Urethane potting materials cure rapidly at room temperature or with mild heat, facilitating efficient processing and shorter production cycles. Their excellent adhesion to various substrates ensures secure encapsulation of electronic components, preventing moisture-induced failures and enhancing long-term reliability. Furthermore, urethane potting materials exhibit good resistance to abrasion and thermal shock, making them suitable for demanding applications such as automotive electronics, industrial sensors, and outdoor lighting fixtures.

Comparing Potting Materials

Flexibility vs. Mechnical Strength

Temperature Resistance

Formulating 1K and 2K Potting Materials

Two-Component (2K) Potting

2K potting compounds also comprise four elements, but the hardener (or its blend) is physically separated from the resin, preventing premature reaction before mixing. With 2K products, the elements must be weighed and blended, initiating the polymerization reaction upon mixing.

Single-Component (1K) Potting

1K potting compounds consist of a blend of four elements. The primary components, Resin and Hardener, are pre-mixed, eliminating the need for additional blending. This makes 1K potting materials ready for immediate use.

4 Major Constituents of Potting Material – 1 K and 2 K Potting

The four main elements and their role in the formulation are as follows:

Table: Four Elements in Potting Material Formulation

Element	Definition
Resin	A naturally occurring or synthetic compound that solidifies through treatment. Its classification varies based on chemical composition and potential applications.
Hardener	This substance (or blend) initiates the polymerization process with the resin. During this chemical reaction, the hardener is consumed and integrates fully into the polymer structure.
Filler	Typically inert, fillers are incorporated into the resin/hardener mixture to achieve desired properties such as thermoshock resistance, density, and dielectric properties.
Adhesive	Various types of additives serve different functions based on requirements. Additives may include (reactive) diluents, anti-foaming agents, adhesion promoters, pigments, etc.

Presentations

Featured Presentation: Product Offerings

KRAYDEN Materials for Potting Applications

Looking to protect and enhance the reliability of your electronic or energy systems? This short presentation introduces KRAYDEN's advanced potting materials—designed to deliver high performance where it matters most.

From thermal endurance to chemical resistance and long-term electrical insulation, our potting compounds are engineered to meet the rigorous demands of modern applications, including power modules, EV electronics, sensors, and PCB encapsulation.

Whether you're sealing out moisture, dissipating heat, or boosting mechanical stability, our potting materials are built to protect your investment—inside and out.

Got questions or need help choosing the right materials for your potting applications? Reach out to us!

Presentations

Application and Product Overview

The presentation delves into the basic if potting material and its corresponding various applications

Guidelines for Potting of plastic encapsulated ICs

The presentation discusses the guidelines for potting of plastic encapsulated ICs

Potting materials

Product selector guide

Parker Lord Potting and Encapsulants

LINQ Potting and Encapsulants

Frequently asked questions

Advantages of potting materials compared to conformal coatings?

What are the benefits of two-component potting materials?

What should I consider when choosing a potting material?

Can I change hardness by altering the mix ratio?

Learn more

Potting Materials

Types of Potting Materials

Acrylic

Urethane

Silicone

Epoxy

Epoxy

Silicone

Acrylic

Urethane

Comparing Potting Materials

Flexibility vs. Mechnical Strength

Temperature Resistance

Formulating 1K and 2K Potting Materials

Two-Component (2K) Potting

Single-Component (1K) Potting

Presentations

Featured Presentation: Product Offerings

KRAYDEN Materials for Potting Applications

Presentations

Application and Product Overview

Guidelines for Potting of plastic encapsulated ICs

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