MacDermid Alpha

MacDermid Alpha

MacDermid Alpha Soldering Materials & Electronics Assembly Solutions

MacDermid Alpha Electronics Solutions develops materials and process solutions for electronics manufacturing, including solder pastes, solder alloys and wire, fluxes, cleaning chemistries, surface-finishing technologies, and semiconductor packaging materials. These technologies support printed circuit board assembly and advanced electronics production across automotive, telecommunications, consumer electronics, aerospace, industrial, medical, semiconductor, data-center, and renewable-energy applications.

As an authorized MacDermid Alpha Electronics Solutions distributor, Krayden supplies selected ALPHA and Kester soldering materials, fluxes, cleaners, and related electronic assembly products. Our team can help customers compare material options, review application and process requirements, and identify suitable products for production, rework, and repair workflows.

Markets Served by MacDermid Alpha

Automotive Aerospace & Defense Consumer Electronics Industrial Electronics Medical Devices Telecommunications Semiconductor Manufacturing Data Centers Renewable Energy

Featured MacDermid Alpha Brands

ALPHA and Kester cover solder pastes, solder alloys and wire, fluxes, cleaning materials, and related electronics-assembly applications.

ALPHA

ALPHA®

ALPHA materials support electronic assembly with solder pastes, solder alloys, fluxes, preforms, solder wire, and rework products used across automated and high-reliability manufacturing environments.

Kester

Kester®

Kester offers solder wire, fluxes, solder pastes, and cleaning chemistries for automated assembly, manual soldering, repair, and rework processes in electronics manufacturing.

 
MacDermid Alpha solder paste application
Surface Mount Assembly Materials

Solder Pastes

MacDermid Alpha solder pastes combine solder alloy particles with flux media for surface-mount assembly and reflow processing. The source portfolio includes lead-free and specialty formulations for fine-pitch components, advanced packaging, and high-density PCB assemblies. Paste selection depends on alloy, powder type, printing method, stencil design, reflow profile, residue requirements, and the reliability needs of the finished assembly.

MacDermid Alpha solder paste
Material Type

Solder Pastes

Solder pastes deposit a controlled combination of alloy powder and flux onto PCB pads before component placement and reflow. Product selection should account for alloy composition, powder size, print transfer, stencil life, reflow conditions, residue behavior, and the assembly's process window.

 
MacDermid Alpha solder element application
Solder Alloys & Forms

Solder Elements

MacDermid Alpha solder elements include solder alloys supplied in forms used for production assembly, manual soldering, and electronic rework. The source portfolio includes solder wire, rework alloys, solder bars, preforms, and specialty alloy solutions. Selection should consider alloy composition, melting range, product form, flux-core or solid construction, process method, and the mechanical and electrical requirements of the joint.

MacDermid Alpha lead-free solder alloy
Alloy Form

Solder Alloys

Lead-free solder alloys support wave, selective, dip, and related electronics-assembly processes. Alloy selection should account for melting behavior, silver content, process temperature, joint reliability, copper dissolution, dross performance, and compatibility with the existing assembly process.

MacDermid Alpha solder wire
Material Form

Solder Wires

Solder wire supports manual assembly, prototyping, repair, rework, wave, and selective soldering processes. Available constructions can vary by alloy, wire diameter, and flux-core chemistry, so selection should match the soldering method, joint geometry, residue requirements, and process temperature.

 
MacDermid Alpha solder flux application
Soldering Process Chemistries

Solder Flux

MacDermid Alpha solder flux products support solderability by preparing metal surfaces and promoting wetting during soldering. The source portfolio includes liquid fluxes, tacky fluxes, and associated cleaning chemistries used in wave soldering, selective soldering, hand soldering, rework, and repair. Selection depends on soldering method, flux chemistry, solids content, residue or cleaning requirements, substrate and component sensitivity, and the intended process window.

MacDermid Alpha solder flux
Process Chemistry

Flux

Liquid solder fluxes are used to prepare metal surfaces and support wetting in wave, selective, hand-soldering, and related assembly processes. Selection should consider flux chemistry, activity, solids level, residue behavior, application method, and whether post-solder cleaning is required.

MacDermid Alpha flux cleaner
Cleaning Chemistry

Flux Cleaner

Flux cleaners remove soldering residues and process contamination from assemblies, tools, or stencils when cleaning is required by the process. Selection should reflect the residue type, substrate and component compatibility, cleaning method, drying behavior, and downstream coating or inspection needs.

MacDermid Alpha tacky flux
Process Chemistry

Tacky Flux

Tacky flux provides a higher-viscosity flux medium for localized soldering and rework, including component placement and BGA-related repair operations. Selection should consider flux chemistry, tack level, application method, reflow or heating process, residue requirements, and component geometry.

Application Spotlight

Interconnects for PCB Assemblies

MacDermid Alpha materials support the soldering processes used to create electrical interconnections across printed circuit board assemblies. ALPHA and Kester technologies include solder pastes, solder elements, and flux systems used across surface-mount, wave, selective, rework, and other electronics-assembly processes.

SMT
Solder pastes
Interconnects
Solder elements
Wetting
Solder flux systems
Assembly
PCB soldering processes
Explore the Application Page
Interconnects for PCB assemblies

Talk to our Experts

Krayden can help compare MacDermid Alpha solder pastes, solder alloys and wire, fluxes, and cleaning materials for PCB assembly, soldering, rework, and repair processes. Our team can support product selection, application requirements, process considerations, and comparison of candidate materials for your manufacturing workflow.

Contact our team Call +1 (800) 448-0406

MacDermid Alpha Quick Reference

Brands Carried
ALPHA, Kester
Core Technology
Soldering & Electronics Assembly Materials
Top Categories
Solder Pastes, Solder Elements, Solder Flux
Key Markets
Automotive, Industrial Electronics, Medical Devices, Telecommunications

123 products

  • KESTER 959T Soldering Flux

    KESTER 959T Soldering Flux

    • Excellent wetting
    • Low rosin content
    • Non-corrosive
  • KESTER 952-S Soldering Flux

    KESTER 952-S Soldering Flux

    • Formulated for photovoltaic applications
    • High reliability ribbons
    • Halogen-free & low-solids
  • ALPHA OM-338-PT Paste Solder Flux

    ALPHA OM-338-PT Paste Solder Flux

    • Consistent printing down to 11 mil (0.28 mm)
    • Halide‑free (ROL0)
    • Meets IPC‑7095 Class 3 voiding
  • ALPHA 611

    ALPHA 611

    • Dense Plated-Through-Hole Coverage
    • Controlled RMA Rosin Activity
    • Cleanable Critical-Assembly Residues
  • ALPHA EF-6808HF

    ALPHA EF-6808HF

    • High-Density Hole-Fill Performance
    • Low-Bridging Wave Soldering
    • Transparent Pin-Testable Residue
  • ENTHONE 20/A

    ENTHONE 20/A

    • Two-Hour Mixed-Ink Pot Life
    • Ambient or Heat Cure
    • Permanent Marking Application Flexibility
  • KESTER 2331-ZX Soldering Flux

    KESTER 2331-ZX Soldering Flux

    • Neutral pH
    • Minimal foaming
    • Low-odor emission
  • KESTER 2235 Soldering Flux

    KESTER 2235 Soldering Flux

    • Minimizes icicling and bridging
    • Compatible with most masks and laminates
    • High activity
  • ENTHONE 45

    ENTHONE 45

    • M- and 50-Series Compatibility
    • Catalyst-Selected Cure Control
    • Permanent Marking System Integration
  • ALPHA 615

    ALPHA 615

    • Fast High-Activity RMA Wetting
    • Flexible Foam-or-Spray Processing
    • Cleanable High-Preheat Residues
  • ALPHA EF8300LR

    ALPHA EF8300LR

    • Greater Than 96% Hole Fill
    • Low-Bridging Cu-OSP Soldering
    • Halide-Free Tack-Free Residue
  • ENTHONE 50

    ENTHONE 50

    • Ambient or Heat-Cure Flexibility
    • Multi-Method Permanent Marking
    • Chemical- and Thermal-Resistant Films
  • ALPHA 615-15

    ALPHA 615-15

    • Low-Solids Surface-Mount Selection
    • Flexible Foam-or-Spray Processing
    • Defined Flux-Control Window
  • ALPHA EF-9301

    ALPHA EF-9301

    • Greater Than 95% Hole Fill
    • Low-Bridging SMT Soldering
    • Spray or Foam Fluxing
  • ENTHONE 77

    ENTHONE 77

    • Ambient or Heat-Cure Choice
    • One-Hour Ink Pot Life
    • Heat-Enhanced Adhesion Development
  • Kester TSF-ULR18

    Kester TSF-ULR18

    • Ultra-low residue
    • No-clean formulation
    • High reliability
  • ALPHA HITECH CU11-3127

    ALPHA HITECH CU11-3127

    • One-Component Capillary Underfill
    • 177 deg C Glass Transition
    • 20-Minute 140 deg C Cure
  • ALPHA HF-1

    ALPHA HF-1

    • Wide reflow profile window supporting air and nitrogen reflow with straight-ramp or soak profiles up to 300 °C.
    • ROL0, halide-free flux system with residue suitable to remain on the circuit board without cleaning.
    • Broad rework capability covering touch-up, hand soldering, BGA repair/re-balling, and QFN/LGA repair.
  • ENTHONE AD2001

    ENTHONE AD2001

    • Incremental 3 to 6% Thinning
    • Post-Induction Process Control
    • Extended Ink Pot Life
  • ALPHA NF3000 Water-Soluble Flux

    ALPHA NF3000 Water-Soluble Flux

    • Water-soluble formulation
    • Organic activating system
    • Wide thermal window
  • Kester TSF-6502JCR

    Kester TSF-6502JCR

    • 8-hour stencil life
    • Printing up to <16mil pitch
    • ROL1 & Bellcore GR-78 compliant
  • ALPHA 856

    ALPHA 856

    • Neutral Buffered Residue for Water Cleaning
    • Fast-Recovering Foam for Production Coverage
    • Defined Four-Hour Cleaning Window
  • ENTHONE AD2002

    ENTHONE AD2002

    • Spray-Application Viscosity Control
    • Air-Pressure and Orifice Adjustment
    • Extended Catalyzed-Ink Pot Life
  • ALPHA SC-7525 Cleaner

    ALPHA SC-7525 Cleaner

    • IPA alternative
    • High solvency
    • Suitable for manual & immersive methods
  • KESTER 5252 Cleaner

    KESTER 5252 Cleaner

    • Quickly air dries
    • Halogen-free formulation
    • Non-ionic
  • ALPHA LONCO RF-800 FLUX GALLON YELLOW

    ALPHA LONCO RF-800 FLUX

    • Highly Active Low-Solids No-Clean Flux
    • Low Non-Tacky Residue
    • IPC J-STD-004 ROL0 Classification
  • ALPHA 857

    ALPHA 857

    • Foam and Spray Process Flexibility
    • Controlled Specific-Gravity Flux Consistency
    • Water-Washable Residues Without Rinse Aids
  • ALPHA K75I

    ALPHA K75I

    • ALPHA K75-I provides a high-purity isopropyl alcohol and de-ionized water extract solution designed for ionic cleanliness testing in compliance with MIL-P-28809.
    • ALPHA K99-I provides a dedicated isopropyl-alcohol-based make-up solution for restoring K75-I to the desired alcohol/water ratio.
    • The complementary K75-I/K99-I system supports regular alcohol-percentage adjustment to maintain the accuracy of the ionic test instrument procedure.
  • ENTHONE AD2003

    ENTHONE AD2003

    • Extended Marking-Ink Open Time
    • Incremental 3 to 6% Addition
    • In-Process Machine-Marking Adjustment
  • KESTER 182 Soldering Flux

    KESTER 182 Soldering Flux

    • High-purity composition
    • Meets IPC J-STD-002 and J-STD-003 requirements
    • Excellent electrical reliability
  • ALPHA 90IA

    ALPHA 90IA

    • High-Activity Difficult-Metal Soldering
    • Low-Temperature Light-Gauge Processing
    • Defined Acid-Wash Residue Removal
  • ALPHA NR200

    ALPHA NR200

    • Low-Residue Pin-Test Surface
    • Foam, Spray, or Wave Fluxing
    • High-SIR Tack-Free Surface
  • ENTHONE AD3002

    ENTHONE AD3002

    • Two to Four Percent Flow Adjustment
    • Crawling and Pinholing Control
    • Gentle Post-Induction Mixing
  • KESTER 5744 Solder Saver

    KESTER 5744 Solder Saver

    • Effectively removes dross
    • Low-fuming and remains stable at soldering temperatures.
    • Can be easily skimmed off the pot after use.
  • KESTER RF771 Rework Flux

    KESTER RF771 Rework Flux

    • High thermal stability
    • Leaves bright & shiny solder joints post-reflow
    • Classified as ORM0 per J-STD-004
  • KESTER 958 Soldering Flux

    KESTER 958 Soldering Flux

    • Excellent for bare copper applications
    • Conformal coating compatible
    • Improves soldering performace
  • ALPHA CVP 520

    ALPHA CVP 520

    • Low-Temperature Reflow for Sensitive Assemblies
    • Extended Eight-Hour Stencil Life
    • Configurable Alloy and Powder Selection
  • ALPHA NR330

    ALPHA NR330

    • VOC-Free Water-Based Processing
    • Low Bridging and Solder Balls
    • Non-Tacky Pin-Testable Residue
  • ENTHONE B13/28

    ENTHONE B13/28

    • Accelerated Three-Day Ambient Cure
    • One-Hour Processing Window
    • Nonconductive Black Ink Compatibility
  • KESTER 186 Soldering Flux

    KESTER 186 Soldering Flux

    • Approved under MIL-F-14256 as Rosin Mildly Activated.
    • High thermal stability
    • Excellent electrical reliability
  • KESTER 2166-BN Soldering Flux

    KESTER 2166-BN Soldering Flux

    • Halide-free formulation
    • Superior surface insulation resistance
    • Easy residue removal
  • ELECTROLUBE TCOR 75ML CTG

    ELECTROLUBE TCOR

    • 1.8 W/(m K) Thermal Conductivity
    • One-Component 100% Solids Non-Slump RTV
    • -50 to 230 deg C Operating Range
  • ENTHONE B3

    ENTHONE B3

    • Four-Hour Ink Pot Life
    • Controlled Heat-Cure Processing
    • Faster Cure at Higher Temperature
  • KESTER 951 Soldering Flux

    KESTER 951 Soldering Flux

    • Zero-halogen, non-rosin formula
    • High Surface Insulation Resistance (SIR)
    • Minimizes defects
  • KESTER 186 Flux-Pen

    KESTER 186 Flux-Pen

    • High thermal stability
    • Improves soldering performance
    • ROL1 per J-STD-004 & J-STD-004B
  • KESTER TSF-8808

    KESTER TSF-8808

    • DI-Water-Cleanable Post-Reflow Residues
    • Multi-Alloy Air-or-Nitrogen Reflow
    • ORH0 Low-Volatility Soldering Flux
  • ENTHONE M Series

    ENTHONE M Series

    • Five-Method Permanent Marking
    • One to 24-Hour Pot-Life Options
    • Humidity-Conditioned Electrical Insulation
  • KESTER 977 Soldering Flux

    KESTER 977 Soldering Flux

    • Biodegradable at pH ≥ 2.0
    • Compatible with most solder masks and laminates
    • Does not degrade SIR
  • KESTER 951 Flux-Pen

    KESTER 951 Flux-Pen

    • Improves soldering performance
    • Non-corrosive tack-free residue
    • ORL0 per J-STD-004
  • ALPHA 100

    ALPHA 100

    • Non-Activated Type R Flux
    • IPC J-STD-004 ROL0 Classification
    • Extended 1,080-Day Shelf Life
  • KESTER 979 Solder Flux

    KESTER 979 Solder Flux

    • Chemically compatible with most solder mask & laminates
    • Does not degrade SIR
    • Bellcore GR-78 Compliant
  • KESTER 952-D6 Flux-Pen

    KESTER 952-D6 Flux-Pen

    • Residues almost colorless
    • Improves soldering performance
    • Reduced odor
  • ALPHA 2110

    ALPHA 2110

    • Aqueous Rosin Residue Removal
    • Multiple Cleaning Equipment Formats
    • Stable Silicone-Free Wash Solution
  • ALPHA EF6000

    ALPHA EF6000

    • Low-Residue Rosin-Free No-Clean Flux
    • Broad Lead-Free and Tin-Lead Window
    • Reduced Solder-Ball and Bridging Tendency
  • ALPHA SLS65

    ALPHA SLS65

    • Thermally Stable Bridge Control
    • Low Solder-Ball Tendency
    • Foam, Wave, or Spray Application
  • KESTER NF372-TB Soldering Flux

    KESTER NF372-TB Soldering Flux

    • Provides good solderability at atmospheric temperature
    • Zero-halogen & low solids formulation
    • Safe for rework
  • KESTER 2331-ZX Flux-Pen

    KESTER 2331-ZX Flux-Pen

    • High activity
    • Chemically compatible with most masks and laminates
    • Neutral pH chemistry
  • ALPHA EF-8800HF No Clean Flux

    ALPHA EF-8800HF No Clean Flux

    • Robust soldering performance
    • Evenly spread, tack free residue
    • Halide-free
  • ALPHA 3355-11

    ALPHA 3355-11

    • VOC-Free Water-Soluble Fluxing
    • Flexible Multi-Method Application
    • Thorough Water-Residue Removal
  • ALPHA SLS65C

    ALPHA SLS65C

    • Low-solids, no-clean flux formulated to reduce solder balling and solder bridging in wave and chip-wave soldering.
    • Very low level of non-tacky residue supports pin testing while allowing residues to remain on the board without cleaning.
    • Supports foam, wave, and spray application methods with documented Bellcore and IPC electrical test performance.
  • KESTER 985M Soldering Flux

    KESTER 985M Soldering Flux

    • Low-solid & halide-free
    • No-clean flux
    • Improves soldering performance
  • KESTER TSF-6852 Tacky Soldering Flux

    KESTER TSF-6852 Tacky Soldering Flux

    • 8-hour stencil life
    • Leaves bright and shiny joints
    • ORH1 per J-STD-004
  • ALPHA SM-110 Solvent Cleaner

    ALPHA SM-110 Solvent Cleaner

    • High solvency
    • High flux loading capacity
    • Non-corrosive
  • ALPHA SM351F

    ALPHA SM351F

    • Fast-Wetting Foam and Wave Flux
    • Tack-Free Pin-Testable Residue
    • Halide-Free Low-Solids Formulation
  • KESTER 5252M Cleaner

    KESTER 5252M Cleaner

    • Quickly air dries
    • Halogen-free formulation
    • Non-ionic
  • KESTER TSF-6522RH Tacky Soldering Flux

    KESTER TSF-6522RH Tacky Soldering Flux

    • High tack value
    • Long tack life
    • Can reflow in air or nitrogen
  • ALPHA PoP707 Lead-Free No-Clean Solder Paste

    ALPHA PoP707 Lead-Free No-Clean Solder Paste

    • Fine particle dispersion (<10 µm)
    • ROL0 per IPC J‑STD‑004
    • Outstanding SIR performance
  • ALPHA 425

    ALPHA 425

    • Controlled Flux Property Restoration
    • Specific-Gravity Maintenance Support
    • Long-Interval Process Inventory
  • ALPHA CVP-390

    ALPHA CVP-390

    • Long stencil life
    • Wide reflow profile window
    • Excellent coalescence and wetting performance
  • ALPHA 3355-HB

    ALPHA 3355-HB

    • Broad Conveyor Preheat Window
    • Multi-Method Flux Application
    • Defined Hot-Water Cleaning Process
  • ALPHA CVP-390V Solder Paste

    ALPHA CVP-390V Solder Paste

    • Superior electrochemical reliability
    • Wide process window
    • Reliable post reflows flux residue
  • ALPHA 611F

    ALPHA 611F

    • Low-Pressure Fine-Foam Control
    • Stable Continuous-Aeration Performance
    • Defined Daily Flux Maintenance
  • ALPHA OM-535

    ALPHA OM-535

    • Enables elimination of a second or third reflow cycle
    • 8+ Hour stencil life
    • Compatible with all commonly used Pb-free surface finishes
  • ALPHA 615-25

    ALPHA 615-25

    • Lower-Solids Surface-Mount Selection
    • Flexible Foam-or-Spray Processing
    • Defined Flux-Control Window
  • ALPHA OM340 Solder Paste

    ALPHA OM340 Solder Paste

    • Available in different alloys
    • Maximizes reflow yield for Pb-free processing
    • Excellent print consistency
  • ALPHA EF-12000

    ALPHA EF-12000

    • High-Solids Residue for No-Clean Processing
    • Spray Foam or Wave Process Flexibility
    • Bridging-Resistant Hole-Fill Performance
  • ALPHA EF-2210

    ALPHA EF-2210

    • Low-Solids Residue for Legacy Processing
    • OSP Wave and Selective Soldering
    • Defined EF-2100 Replacement Path
  • ALPHA OM550 Solder Paste

    ALPHA OM550 Solder Paste

    • Low reflow peak temperature
    • Reduction of warpage up to 99%
    • Long stencil life
  • ALPHA EF-6100-R

    ALPHA EF-6100-R

    • Low-solids, alcohol-based no-clean rework flux supporting both lead-free and tin-lead soldering with fast wetting and a wide thermal process window.
    • Very low levels of non-tacky residue help minimize interference with pin testing while supporting no-clean processing.
    • ORL0 classification backed by documented IPC J-STD-004A/J-STD-004B SIR, Bellcore SIR, electromigration, and corrosion test results.
  • ALPHA EF-6100P

    ALPHA EF-6100P

    • Broad Lead-Free Process Window
    • Reduced Bridging and Solder Balls
    • Low-Residue Pin-Test Surface
  • ALPHA EF-8000

    ALPHA EF-8000

    • Greater Than 96% Hole Fill
    • Low-Bridging Connector Soldering
    • Spray or Foam Application
  • ALPHA RMA390

    ALPHA RMA390

    • Wide reflow profile window supporting air and nitrogen reflow with straight-ramp or soak profiles up to 300 °C.
    • ROL0, halide-free rosin-based paste flux whose post-reflow residue is suitable to remain on the circuit board without cleaning.
    • Flexible application by screen printing, pin transfer, doctor blade, dip coating, or dispensing, with documented SIR and electromigration performance.
  • ALPHA UP-78 Solder Paste

    ALPHA UP-78 Solder Paste

    • Stable Tack Across Production Shifts
    • Clear, Colorless, Penetrable Post-Reflow Residue
    • Standard and Fine-Pitch Stencil Printing
  • ALPHA EF2202

    ALPHA EF2202

    • VOC-Free No-Clean Legacy Process Reference
    • Historical Wave-Solder Process Fit
    • Direct EF-2100 Replacement Path
  • ALPHA WS609

    ALPHA WS609

    • Four-Hour Stencil Life
    • Complete Water-Cleanable Residue Removal
    • Type 3 to 5 Powders
  • ALPHA EF6100

    ALPHA EF6100

    • Alloy-Specific Wave Process Control
    • Low-Solids Pin-Testable Residue
    • High-Reliability No-Clean Soldering
  • ALPHA WS619

    ALPHA WS619

    • 0.008-Inch Fine-Pitch Printing
    • Over Four Hours Stencil Life
    • Completely Water-Soluble Flux
  • ALPHA HT-130DM

    ALPHA HT-130DM

    • Non-Sag High-Speed Dispensing
    • Fast 80-Second Heat Cure
    • High-Resistance Electrical Insulation
  • ALPHA WS809

    ALPHA WS809

    • Print Speeds From 1 to 6 Inches
    • Eight-Hour Stencil Life
    • Water-Cleanable After Two Reflows
  • ALPHA WS826

    ALPHA WS826

    • Eight-Hour High-Humidity Stencil Life
    • Air or Nitrogen Reflow
    • Zero-Halogen Water-Soluble Flux
  • ALPHA SACX Plus 0307

    ALPHA SACX Plus 0307

    • Low dross formation
    • Excellent mechanical reliability
    • Made with Vaculoy technology
  • CNP CVP390V

    CNP CVP390V

    • 170 um Fine-Feature Coalescence
    • Over Eight-Hour Stencil Life
    • Air or Nitrogen Reflow
  • ALPHA SACX0307

    ALPHA SACX0307

    • 217 to 228 deg C Melting Range
    • Low-Dross Vaculoy Processing
    • Bar, Ingot, or Wire Supply
  • CNP OM338PT

    CNP OM338PT

    • Fine-feature solder paste with demonstrated full alloy coalescence on circular deposits as small as 0.225 mm using a 0.100 mm stencil.
    • Supports print speeds up to 150 mm/s with an 8-hour stencil life and is formulated for increased in-circuit pin-test yields.
    • ROL0, halogen-free no-clean formulation with IPC-7095 Class 3 voiding performance and documented electrical reliability results.
  • ALPHA SACX0807

    ALPHA SACX0807

    • Low-silver lead-free solder alloy designed to provide soldering and reliability performance similar to higher-silver ALPHA SAC alloys while reducing material cost versus SAC305.
    • Low dross rate, low copper erosion rate, and low surface tension support alloy utilization, fast wetting, high wetting force, and excellent hole fill.
    • Suitable for lead-free wave and selective soldering across single- and double-sided boards, including assemblies with OSP pad finishes exposed to prior reflow excursions.
  • CNP OM338T

    CNP OM338T

    • Ultra-fine feature solder paste supporting full alloy coalescence on circular dimensions as small as 0.25 mm with a 0.100 mm stencil.
    • High-throughput printing at speeds up to 200 mm/s with greater than 8-hour stencil life at 50% RH and 23 °C.
    • ROL0, halide-free no-clean formulation with IPC-7095 Class III voiding performance and documented electrical reliability.
  • ALPHA SM42-120P

    ALPHA SM42-120P

    • One-component, fast-curing epoxy surface mount adhesive designed for both screen printing and dispensing.
    • Non-sagging formulation with documented excellent adhesion, thermal resistance, and workability.
    • Cured material provides a Tg of 110 +/- 10 °C and insulation resistance greater than 1 x 10^12 ohms after 96 hours at 85 °C/85% RH.
  • ALPHA SM42-1311

    ALPHA SM42-1311

    • High-Speed Room-Temperature Dispensing
    • 80-Second Cure at 150 deg C
    • Non-Sagging Epoxy Paste
  • CNP OM340

    CNP OM340

    • Fine-Feature High-Speed Printing
    • Eight-Hour Stencil Life
    • Air or Nitrogen Reflow
  • CNP OM350

    CNP OM350

    • Fine-feature no-clean solder paste with demonstrated Pin-in-Paste performance and robust solderability across OSP-Cu, Immersion Ag, Immersion Sn, ENIG, and lead-free HASL finishes.
    • Greater than 6-hour stencil life at 25 °C with stable storage and handling performance up to 30 °C for 21 days.
    • Halide-free ROL0 formulation with IPC Class III voiding performance and documented SIR and electromigration reliability results.
  • ALPHA Vaculoy SAC305 Solder Bar

    ALPHA Vaculoy SAC305 Solder Bar

    • Fast wetting
    • Excellent solderability
    • Very good drainage
  • CNP OM362

    CNP OM362

    • Ultra-Low BTC Voiding
    • Eight-Hour Print Stability
    • Fine-Pitch SIR Performance
  • ALPHA WS362

    ALPHA WS362

    • High-activity, 25% solids water-soluble flux designed for densely packed assemblies and multilayer boards requiring relatively high preheat temperatures.
    • Highly water-soluble post-solder residues support effective cleaning for high ionic cleanliness and surface insulation resistance.
    • Halide-free formulation with rapid wetting and support for foam, spray, or wave application techniques.
  • CNP OM5100

    CNP OM5100

    • Low-Residue No-Clean Processing
    • First-Pass Assembly Yield Support
    • Configurable SMT Process Fit
  • ALPHA WS600

    ALPHA WS600

    • Three Application-Specific Viscosity Options
    • Eight-Hour Stencil Life
    • Water-Soluble Halide-Free Chemistry
  • CNP OM5300

    CNP OM5300

    • Mixed-Technology SMT Soldering
    • No-Clean Tin-Lead Processing
    • Configuration-Controlled Reflow Fit
  • CNP OM565

    CNP OM565

    • Low-Temperature 175 deg C Reflow
    • 01005 Fine-Feature Printability
    • Eight-Hour Stencil Stability
  • KESTER EM808 Solder Paste

    KESTER EM808 Solder Paste

    • Excellent solderability
    • Print speed up to 150 mm/sec
    • Excellent anti-slumping features
  • KESTER EM828 Solder Paste

    KESTER EM828 Solder Paste

    • Low-voiding
    • Excellent wetting
    • Long stencil life
  • KESTER EP256 Solder Paste

    KESTER EP256 Solder Paste

    • Stable wetting behavior
    • Excellent printing characteristics
    • High activity on all substrates
  • Hi-Flo Solder Bar Sn63Pb37

    Hi-Flo Solder Bar Sn63Pb37

    • Reduced Wave-Soldering Bridging and Icicling
    • Vaculoy Ultra-High-Purity Manufacturing
    • Conventional or Inert-Atmosphere Wave Soldering
  • KESTER HM531

    KESTER HM531

    • Excellent anti-slump characteristics
    • Minimal voiding under BGA components
    • Great solderability
  • KESTER NP505-HR Solder Paste

    KESTER NP505-HR Solder Paste

    • High reliability
    • Exceptional print performance
    • Zero-halogen formula
  • KESTER NP545 Solder Paste

    KESTER NP545 Solder Paste

    • 0.50-Area-Ratio Fine-Feature Printing
    • Zero-Halogen No-Clean Residue
    • Air or Nitrogen Reflow Wetting
  • KESTER R520A Solder Paste

    KESTER R520A Solder Paste

    • Pb-free
    • Stable tack life
    • Consistent printing
  • KESTER R562 Solder Paste

    KESTER R562 Solder Paste

    • Reduces BGA voiding
    • 12-hour stencil life
    • Consistent printing
  • KESTER 1429

    KESTER 1429

    • VOC-Free Water-Based Fluxing
    • Self-Neutralizing Post-Solder Residue
    • Water-Only Residue Removal
  • KESTER 1544

    KESTER 1544

    • Activated Rosin Oxide Removal
    • Fast Wetting and Capillary Flow
    • Non-Conductive Post-Solder Residue
  • KESTER 186-18

    KESTER 186-18

    • High-Preheat Thermal Stability
    • RMA-Style Flux Activity
    • Low-Corrosion No-Clean Residue
  • Kester K100LD Lead-Free Solder Wire

    Kester K100LD Lead-Free Solder Wire

    • Eutectic Sn/Cu alloy
    • Controlled metallic dopants
    • Refined grain structure
  • SACX Plus 0807

    SACX Plus 0807

    • Low-Silver, Lead-Free Alloy
    • 216 to 225 deg C Solidus-Liquidus Range
    • Vaculoy Oxide-Reduction Processing
  • SnCX Plus 07

    SnCX Plus 07

    • Silver-Free Lead-Free Wave-Soldering Alloy
    • Reduced Copper Dissolution at High Temperature
    • Vaculoy Low-Dross Fast-Wetting Processing
  • ALPHA AutoClean 40 Electronic Cleaner

    ALPHA AutoClean 40 Electronic Cleaner

    • Ready-to-Use Aqueous Cleaning
    • Immersion, Ultrasonic, or Manual Cleaning
    • Non-Flammable Water-Based Formulation

Leading Brands Trust in Our Products and Services

  • Jabil
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  • AMS
  • Apple
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