Dow

Dow

Dow Silicone Electronics Protection, Thermal Management and Liquid Cooling Solutions

Dow supplies silicone-based materials for bonding and sealing, electronics protection, thermal management, conformal coating, encapsulation, and liquid cooling. Krayden-relevant technologies include DOWSIL™ adhesive sealants, primers, thermal interface materials, conformal coatings, and silicone foams; SYLGARD™ dielectric gels and elastomer systems; DOWFROST™ inhibited heat-transfer fluids; and selected XIAMETER™ silicone materials for industrial processing and formulation applications.

As an authorized Dow distributor, Krayden supplies a broad selection of Dow materials and provides technical guidance for product selection, application requirements, processing considerations, and comparison of candidate materials. Cure behavior, substrate compatibility, bond-line or gap geometry, dispensing method, electrical requirements, thermal performance, and fluid-system compatibility are product- and application-specific and should be confirmed for the selected formulation and assembly.

Markets Served by Dow

Aerospace & Defense Automotive & E-Mobility Electronics & Semiconductors Data Centers & Cloud Infrastructure Industrial Manufacturing & Automation Energy & Renewable Power Power Electronics & Electrical Infrastructure Telecommunications Building & Construction Appliances & Consumer Electronics

Featured Dow Brands

Four Dow brands represented across silicone bonding, electronics protection, thermal management, heat-transfer fluids, and industrial silicone materials.

DOWSIL brand logo

DOWSIL™

Silicone adhesives, sealants, conformal coatings, encapsulants, thermal materials, foams, primers, and related electronics and industrial materials.

SYLGARD brand logo

SYLGARD™

Silicone dielectric gels and elastomer systems used for potting, encapsulation, casting, cushioning, and low-stress electronics protection.

DOWFROST brand logo

DOWFROST™

Inhibited heat-transfer fluids used in industrial cooling, closed-loop systems, and appropriate data-center and liquid-cooling applications.

XIAMETER brand logo

XIAMETER™

Silicone fluids, elastomers, intermediates, and related materials used in industrial processing and formulation applications.

 
Dow adhesive and sealant application
DOWSIL™ Bonding & Sealing Materials

Adhesives & Sealants

Dow bonding and sealing materials include one-part RTV silicone adhesive sealants, higher-performance silicone adhesive technologies, and primers or adhesion promoters used to prepare challenging substrates. Selection depends on cure method, handling strength, substrate combination, bond-line or seal geometry, environmental exposure, production method, and whether primer-assisted adhesion is required for the specified assembly.

DOWSIL 3145 RTV adhesive sealant
Cure Method

RTV / One-Part Adhesives & Sealants

One-part room-temperature-vulcanizing silicone materials support bonding, sealing, and formed-in-place gasketing without separate component mixing. Product-specific cure mechanism, skin time, depth of cure, substrate preparation, and qualification requirements should be confirmed before use.

DOWSIL 3-6265 HP adhesive
Performance Class

High-Performance Adhesives

Higher-performance silicone adhesive grades are used where stronger mechanical attachment, durable sealing, or defined processing behavior is needed. Match the formulation to the substrate pair, cure process, desired flow or bead profile, required handling strength, and service environment.

Dow primer and adhesion promoter for silicone bonding
Surface Preparation

Primers & Adhesion Promoters

DOWSIL primers and prime coats can be used with selected silicone adhesives and sealants to improve adhesion or prepare difficult non-porous substrates. Primer choice, cleaning method, application amount, drying conditions, and compatibility with the selected silicone and substrate should be validated for the intended bond.

 
Dow encapsulant and gel application
DOWSIL™ & SYLGARD™ Electronics Protection

Encapsulants & Gels

Dow dielectric gels and silicone elastomer systems protect electronic assemblies through low-stress cushioning, dielectric protection, potting, casting, and environmental isolation. Soft gels are suited to sensitive components where mechanical stress must be limited, while cured elastomer systems provide more defined support and encapsulation. Selection should account for cured modulus, working time, cure schedule, fill geometry, component sensitivity, dielectric requirements, and rework strategy.

SYLGARD 527 silicone dielectric gel
Material Type

Dielectric Gels

Soft silicone dielectric gels provide cushioning and electrical protection while limiting stress on fine-pitch components, sensors, bond wires, connectors, and other sensitive features. Product selection should consider gel softness, cure conditions, fill depth, dielectric requirements, component movement, and the required level of environmental protection.

SYLGARD 160 silicone elastomer kit
Material Type

Silicone Elastomer & Potting Systems

Two-part silicone elastomer systems cure to flexible solids for potting, casting, cushioning, and environmental protection where a more supportive encapsulation is required than a soft gel provides. Evaluate viscosity and fill behavior, working time, cure speed, cured hardness, part geometry, and the mechanical support required around components.

 
DOWSIL thermal interface material application
DOWSIL™ Thermal Management Materials

Thermal Interface Materials

Dow thermal-management materials span curable gap fillers and thermal gels, thermally conductive adhesives, non-curing compounds and greases, and thermally conductive encapsulants. Selection should start with the required thermal path and gap or bond-line thickness, then account for compressibility, dispensing method, cure requirements, electrical insulation, mechanical attachment, reworkability, component stress, and service conditions.

DOWSIL thermally conductive gap filler or thermal gel
Interface Format

Thermally Conductive Gap Fillers & Thermal Gels

Curable gap fillers and thermal gels conform to component-to-housing spaces to create a heat-transfer path while accommodating dimensional variation and limiting assembly stress. Selection should consider gap thickness, compressibility or cured softness, dispense rate, cure schedule, thermal requirement, vertical stability, and vibration or stress-relief needs.

DOWSIL thermally conductive adhesive
Bonding Function

Thermally Conductive Adhesives

Thermally conductive silicone adhesives combine heat transfer with mechanical attachment for components such as heat sinks, housings, control modules, and power-electronics assemblies. Evaluate bond-line control, adhesion to the substrate pair, cure temperature or moisture-cure requirements, mechanical loading, electrical isolation, and whether permanent attachment is appropriate.

DOWSIL TC-5026 thermally conductive compound
Material Form

Compounds & Greases

Non-curing thermally conductive compounds and greases remain serviceable at the interface while supporting heat transfer between components and heat sinks. Selection should consider bond-line geometry, thermal resistance, pump-out or flow behavior, electrical requirements, application method, surface flatness, and future rework or service needs.

DOWSIL thermally conductive encapsulant
Encapsulation Function

Thermally Conductive Encapsulants

Curable thermally conductive encapsulants combine heat dissipation with component protection in assemblies such as power electronics, converters, chargers, and magnetics. The formulation should be evaluated for flow into the target geometry, cure process, thermal path, electrical insulation, cured hardness, mechanical support, component stress, and long-term service conditions.

 
Dow conformal coating application
DOWSIL™ Circuit-Board Protection

Conformal Coatings

DOWSIL conformal coatings protect printed circuit assemblies from moisture, contamination, corrosion, and environmental exposure using multiple processing approaches. Depending on the product, options include moisture cure with room-temperature or heat-accelerated processing, UV cure with secondary moisture cure, lower-VOC solvent-borne systems, and no-added-solvent technologies. Selection should consider application method, cure window, coating coverage, production-line compatibility, rework needs, and required assembly protection.

DOWSIL silicone conformal coating
Cure Method

Moisture / Heat Cure Conformal Coatings

Selected one-part silicone conformal coatings use moisture cure and may allow heat acceleration to shorten the production cure window. These materials can suit spray or dip processes depending on grade. Evaluate coating viscosity, film build, ambient humidity, cure schedule, masking strategy, coverage around components, and rework requirements.

Dow UV and dual-cure conformal coating
Cure Method

UV / Dual-Cure Conformal Coatings

UV-curable DOWSIL coatings can provide rapid primary cure on exposed areas, with secondary moisture cure used by selected grades for shadowed regions. Match the coating to UV or UV-LED equipment, line speed, dispense or spray method, part shadowing, film thickness, inspection method, and any downstream rework process.

Dow low-VOC or no-solvent conformal coating
Processing Profile

Low-VOC & No-Added-Solvent Technologies

Dow offers conformal-coating approaches that reduce solvent content or use no added solvent, depending on the product family and cure method. Process selection should account for ventilation and line controls, viscosity, nonvolatile content, cure equipment, target coating thickness, wetting and coverage, board design, and repair or rework requirements.

 
DOWFROST liquid cooling and heat transfer application
DOWFROST™ & DOWSIL™ Cooling Technologies

Liquid Cooling & Heat Transfer Fluids

Dow supports liquid-cooling architectures from direct-to-chip technology cooling loops to facility water-loop heat transfer and immersion cooling. DOWFROST LC-25 is positioned for direct-to-chip data-center cooling, while other DOWFROST fluids serve closed-loop infrastructure and DOWSIL dielectric fluids support immersion-cooling designs. Fluid selection is system-specific and should account for loop materials, heat load, corrosion control, operating temperature, electrical requirements, maintenance practices, and equipment-manufacturer guidance.

Direct-to-chip liquid cooling system using DOWFROST heat transfer fluid
Cooling Architecture

Direct-to-Chip Cooling Fluids

DOWFROST™ LC-25 is formulated for direct-to-chip technology-cooling loops where efficient heat removal and corrosion protection are required around high-surface-area copper components. Evaluate concentration, loop metallurgy, seals and hoses, operating temperature, freeze protection, corrosion-control requirements, water quality, and the equipment supplier's fluid guidance.

Dow facility and closed-loop cooling fluid application
Cooling Architecture

Facility & Closed-Loop Cooling Fluids

DOWFROST heat-transfer fluids are used in closed-loop HVAC and facility cooling systems that support stable temperature control and infrastructure protection. The appropriate fluid depends on system metallurgy, target operating range, freeze protection, inhibitor package, water quality, pumping conditions, maintenance practices, and the design requirements of the facility loop.

DOWSIL immersion cooling fluid application in a data center
Cooling Architecture

Immersion Cooling Fluids

Dow's DOWSIL immersion-cooling technology uses dielectric silicone-based fluids for direct-contact cooling of data-center electronics. System design should evaluate dielectric requirements, thermal performance, fluid viscosity, material compatibility, fluid containment, filtration or service practices, equipment architecture, and manufacturer guidance for the specific server and cooling platform.

 
Dow silicone foam and compression gasketing application
DOWSIL™ Silicone Foam Sealing Materials

Silicone Foams & Gasketing

DOWSIL two-part silicone foams can be dispensed and cured directly on parts to create integrated compression gaskets and environmental seals. These materials are relevant to automotive components, electrical housings, exterior lighting, appliances, and industrial enclosures where sealing force, gap variation, compression recovery, vibration damping, and automated gasket placement are important selection factors.

Foamed-in-place silicone gasketing on an enclosure
Application Method

Foamed-in-Place Gasketing

Two-part RTV silicone foams can be robotically or manually dispensed onto parts and cured in place to form an integrated compression gasket. The process can reduce separate gasket handling while accommodating complex paths and production-specific sealing geometries.

Silicone foam compression and environmental seal
Sealing Function

Compression & Environmental Sealing Foams

Cured silicone-foam gaskets can provide compliant compression sealing against air, splashed water, dust, or moisture while also accommodating tolerance variation and vibration. Typical applications include electrical housings, lighting assemblies, appliance components, and automotive parts.

Application Spotlight

Direct-to-Chip Liquid Cooling for Data Centers

DOWFROST™ LC-25 supports direct-to-chip liquid-cooling loops used to remove heat from high-density computing equipment. Fluid selection should be evaluated as part of the complete cooling architecture, including operating temperature, loop materials, corrosion-control requirements, water quality, maintenance practices, and equipment-manufacturer guidance.

Fluid
DOWFROST™ LC-25
Cooling
Direct-to-chip loops
Compatibility
Loop materials & seals
Operations
Water quality & maintenance
Explore the Application Page
Direct-to-chip liquid cooling system using DOWFROST heat transfer fluid

Talk to our Experts

Whether you are comparing Dow materials for bonding and sealing, electronics protection, conformal coating, thermal management, gasketing, or liquid cooling, Krayden can help evaluate product fit, application requirements, process constraints, and candidate materials for your assembly or cooling system.

Contact our team Call +1 (800) 448-0406

Dow Quick Reference

Brands Carried
DOWSIL, SYLGARD, DOWFROST, XIAMETER
Core Technology
Silicone Materials, Electronics Protection, Thermal Management & Liquid Cooling
Top Categories
Adhesives & Sealants, Encapsulants & Gels, Thermal Interface Materials, Liquid Cooling
Key Markets
Electronics, Data Centers, Automotive & E-Mobility, Aerospace & Industrial

163 products

  • DOWSIL™ EA-7300 Adhesive

    DOWSIL™ EA-7300 Adhesive

    • Dual-cure system
    • Fast processing
    • Broad adhesion
  • DOWSIL 3-0115 Automotive Sealant

    DOWSIL 3-0115 Automotive Sealant

    • Automotive Powertrain-Fluid Resistance
    • Blowout-Resistant In-Line Leak Testing
    • Primerless Metal and Plastic Adhesion
  • DOWSIL EE-1010 LOW VISCOSITY ENCAPSULANT

    DOWSIL EE-1010 LOW VISCOSITY ENCAPSULANT

    • Low-Viscosity Encapsulant Application
    • Controlled Cure Flexibility
    • Firm Elastomeric Electrical Protection
  • DOWSIL 3-8186

    SILASTIC 3-8186

    • Low-Force Elastomeric Foam for Dispensed-in-Place Compression Gasketing
    • Reduced-Flow Robotic Bead Dispensing
    • 10-Minute 75 deg C Cure
  • DOWSIL 9-1374

    DOWSIL 9-1374

    • One-Part Low-Odor Neutral Cure
    • Primerless Multi-Substrate Adhesion
    • -55 to 180 deg C Flexibility
  • DOWSIL ME-4039

    DOWSIL ME-4039

    • Transparent Addition-Cure Silicone Encapsulant
    • 91.5% Transmission at 450 Nm
    • 26-Minute 125 deg C Cure
  • DOWSIL Q3-6611

    DOWSIL Q3-6611

    • Self-Leveling Flowable Dispensing
    • Temperature-Controlled Rapid Cure
    • High Tensile Strength
  • DOWSIL SE9184

    DOWSIL SE 9184

    • Fast Tack-Free Rt Cure
    • Non-Sag Placement Control
    • Thermally Conductive Thermal Bonding
  • DOWSIL 3-6891

    DOWSIL 3-6891

    • Machinable Abradable Rubber
    • 0.95 Cured Specific Gravity
    • Two-Hour 300 deg F Cure
  • DOWSIL™ EI-2888 Primerless Silicone Encapsulant Kit

    DOWSIL™ EI-2888 Primerless Silicone Encapsulant Kit

    • Primerless processing for simpler assembly workflows
    • Optically clear protection for LED and display electronics
    • Soft silicone encapsulation for environmental and electrical protection
  • DOWSIL 340 SILICONE HEAT SINK GREASE

    DOWSIL 340 SILICONE HEAT SINK GREASE

    • Reworkable Thermal Interface Material
    • Device-to-Heat-Sink Heat Transfer
    • No-Mix No-Oven Processing
  • DOWSIL HC 1000 Silicone Adhesive

    DOWSIL HC 1000 Silicone Adhesive

    • One-Part, Solventless Silicone Coating
    • Room-Temperature Adhesive Cure
    • 21 kV/mm Dielectric Strength
  • DOWSIL 510

    DOWSIL 510

    • Available in Four Viscosities
    • High-Temperature Fluid Stability
    • Low-Volatility Process Fluid
  • DOWSIL 92-009

    DOWSIL 92-009

    • Room-Temperature Coating Cure
    • Brush, Dip, Pour, and Spray Application
    • Coating Build of 5 to 6 Mils
  • DOWSIL ME-4046

    DOWSIL ME-4046

    • Low-Modulus Cured Encapsulation
    • 660 cP Application Viscosity
    • One-Hour Cure Cycle
  • DOWSIL RSN-0804

    DOWSIL RSN-0804

    • Hard Silicone Binder Resin
    • 30 cP Resin Viscosity
    • Short-Duration Heat-Resistant Coating Formulations
  • DOWSIL SE 9187 L

    DOWSIL SE 9187 L

    • One-Part Moisture-Cure Adhesive
    • Eight-Minute Tack-Free Time
    • 20 kV/mm Dielectric Strength
  • DOWSIL 520

    DOWSIL 520

    • Water-Dilutable 40% Active Emulsion
    • Deep Mineral-Substrate Penetration
    • Substrate-Specific Water Repellency
  • DOWSIL™ Q1-9226 Thermally Conductive Adhesive

    DOWSIL™ Q1-9226 Thermally Conductive Adhesive

    • Two-part system
    • Accelerated heat cure
    • Robust mechanical & electrical profile
  • DOWSIL ME 1140 Silicone Adhesive

    DOWSIL ME 1140 Silicone Adhesive

    • Solvent-Free Bonding Formulation
    • 60-Minute 130 deg C Cure
    • Low-Modulus Cured Bonding
  • DOWSIL 20

    DOWSIL 20

    • Heat-Stable Non-Carbonizing Parting Film
    • Solvent-Dilutable Release Formulation
    • Plastic/Adhesive/Elastomer Product Applications
  • DOWSIL 700

    DOWSIL 700

    • One-Part Moisture-Cure Adhesive
    • Up to 204 deg C Service
    • FDA 21 CFR 177.2600 Compliance
  • DOWSIL ME-4131

    DOWSIL ME-4131

    • One-Part Clear Addition-Cure Silicone Coating for Die Coating
    • 6,575 cP Application Viscosity
    • 19 kV/mm Dielectric Strength
  • DOWSIL RSN-0805

    DOWSIL RSN-0805

    • Decorative and Protective Coating Resin
    • Enhanced Coating Softness and Flexibility
    • Standalone or Blendable Resin Use
  • DOWSIL SE9188

    DOWSIL SE 9188

    • 10-Minute Tack-Free Time
    • 2.9 MPa Cured Tensile Strength
    • UL 94 V-0 Classification
  • DOWSIL 7094

    DOWSIL 7094

    • Self-Leveling Flowable Placement
    • 400% Cured Elongation
    • 25-Minute Skin-Over Time
  • DOWFROST LC 25 Heat Transfer Liquid

    DOWFROST LC 25 Heat Transfer Liquid

    • Made with Dow PURAGUARD™ USP/EP grade PG (>99.8% purity)
    • Freeze protection to –10°C (14°F)
    • Formulated for high-efficiency heat transfer
  • DOWSIL™ SE 9168 RTV

    DOWSIL™ SE 9168 RTV

    • Fast processing
    • Flame resistance
    • Controlled volatility
  • DOWSIL 236

    DOWSIL 236

    • Durable, Dry-Surfaced Silicone Rubber Coating
    • Sticky-Material Adhesion Prevention
    • Multiple Application Methods
  • DOWSIL 7092

    DOWSIL 7092

    • Immediate Green Strength
    • One-Component, Neutral Moisture-Cure Formulation
    • Flexible Cured Adhesive
  • DOWSIL 93-076 RF

    DOWSIL 93-076 RF

    • Moisture and Weather Resistance
    • 2-Hour Working Window
    • 5.2 MPa Cured Tensile Strength
  • DOWSIL ME-4132

    DOWSIL ME-4132

    • One-Part Black Microelectronics-Grade Silicone Encapsulant for Sensors
    • 138% Cured Elongation
    • Low-Modulus Cured Encapsulation
  • DOWSIL RSN-0806

    DOWSIL RSN-0806

    • Colored Baking-Enamel Resin
    • Up to 538 deg C Temperature Use
    • Standalone or Blendable Resin Use
  • DOWSIL SE 9189 L

    DOWSIL SE 9189 L

    • One-Part Flowable RTV Silicone Adhesive
    • Eight-Minute Tack-Free Time
    • 25 kV/mm Dielectric Strength
  • DOWSIL 790

    DOWSIL 790

    • +100/-50% Joint Movement
    • Ultra-Low-Modulus Cured Seal
    • Non-Sag 10-20-Minute Tooling
  • DOWSIL™ 1-2620 Low VOC Conformal Coating

    DOWSIL™ 1-2620 Low VOC Conformal Coating

    • One-part silicone conformal coating
    • Wide operating temperature range (-45°C to 200°C)
    • UV indicator for inspection and process control
  • DOWSIL™ TC-2022 Thermally Conductive Adhesive

    DOWSIL™ TC-2022 Thermally Conductive Adhesive

    • Heat curable at moderate temperatures
    • Cost effective with rapid/low temperature cure
    • Applicable on heat-sensitive substrates and components
  • DOWSIL 550 SILICONE FLUID

    DOWSIL 550 SILICONE FLUID

    • Silicone Fluid Formulation
    • High-Temperature Silicone-Fluid Stability
    • Low-Volatility Silicone Fluid
  • DOWSIL Q1-4010 CONFORMAL COATING

    DOWSIL Q1-4010 CONFORMAL COATING

    • One-Part, Solventless Silicone Coating
    • Multiple Supported Application Methods
    • UV-Aided Coating Inspection
  • DOWSIL 280A

    DOWSIL 280A

    • Tack/Adhesion up to 260 deg C
    • Solvent-Based Peroxide-Cure Silicone PSA
    • Masking, Plating, and Splicing Tapes
  • DOWSIL 710

    DOWSIL 710

    • Up to 260 deg C Closed-System Service
    • Low-Volatility Oxidation-Resistant Fluid
    • High-Temperature Lubrication/Heat-Transfer Applications
  • DOWSIL 93-500

    DOWSIL 93-500

    • Low-Outgassing Vacuum Bonding
    • 2.5-Hour Working Window
    • Flexible Cured Adhesive
  • DOWSIL OS-125

    DOWSIL OS-125

    • Silicone-Contamination Cleaning Solvent Blend
    • Immersion, Spray, Rinse, or Wipe Cleaning
    • ppm-Level Residual Silicone
  • DOWSIL RSN-0840

    DOWSIL RSN-0840

    • Medium-Hard Silicone Binder Resin
    • 60% Resin Solids
    • Coating Heat/Weather/Flow/Gloss Improvement
  • DOWSIL TC-4515

    DOWSIL TC-4515

    • 1.8 W/(m K) Thermal Conductivity
    • 60-Minute Working Window
    • 50 Shore 00 Hardness with Vertical-Hold Rheology
  • DOWSIL 791

    DOWSIL 791

    • +/-50% Weatherseal Movement
    • Zero-Flow Weatherseal Application
    • 20-Minute Weatherseal Tooling
  • SYLGARD™ 170 Silicone Elastomer Kit

    SYLGARD™ 170 Silicone Elastomer Kit

    • Low mixed viscosity for flow into complex PCB assembly geometries
    • Shore A 47 flexible elastomer for stress relief and mechanical protection
    • UL 94 V-0 flame rating with 0.48 W/m·K thermal conductivity
  • DOWSIL™ TC-2035 Thermally Conductive Adhesive

    DOWSIL™ TC-2035 Thermally Conductive Adhesive

    • 3.3 W/m·K thermal conductivity
    • Ultra-thin bondline thickness
    • Low volatile content
  • DOWSIL 6-1104 CV SILICONE SEALANT

    DOWSIL 6-1104 CV SILICONE SEALANT

    • Low-Outgassing Vacuum Sealing
    • 610% Cured Elongation
    • One-Part Moisture-Cure Sealing
  • DOWSIL SILASTIC Q3-3636 Adhesive

    DOWSIL SILASTIC Q3-3636 Adhesive

    • Two-Component Fast-Cure Silicone
    • Flexible Mix-Ratio Processing
    • Low-Fogging Silicone Adhesive
  • DOWSIL 733

    DOWSIL 733

    • Non-Slumping Vertical/Overhead Application
    • Primerless Glass, Metal, and Plastic Adhesion
    • -57 to 177 deg C Flexibility
  • DOWSIL 94-003

    DOWSIL 94-003

    • One-Part Moisture-Cure Adhesive
    • Fuel, Oil, and Moisture Resistance
    • Brush, Dip, or Spray Application
  • DOWSIL RSN-0994

    DOWSIL RSN-0994

    • Heat-Resistant Electrical Varnish
    • At Least 49% Solids
    • AIEE Class 220 deg C Insulation
  • DOWSIL TC-4535

    DOWSIL TC-4535

    • 3.4 W/(m K) Thermal Interface
    • 60-Minute Working Window
    • 52 Shore 00 Hardness with Vertical-Hold Rheology
  • DOWSIL 795

    DOWSIL 795

    • Structural and Weatherseal Versatility
    • Class 50 Glazing Movement
    • 20-30-Minute Glazing Work Window
  • DOWSIL™ 3145 RTV Mil-A-46146 Adhesive/Sealant

    DOWSIL™ 3145 RTV Mil-A-46146 Adhesive/Sealant

    • Military-grade
    • High strength
    • Non-flowing paste
  • DOWSIL™ TC-4060 Thermal Gel

    DOWSIL™ TC-4060 Thermal Gel

    • 6 W/m·K
    • Room-temperature cure
    • 100% silicone (PDMS) formulation
  • DOWSIL 730 FS SOLVENT RESISTANT SEALANT

    DOWSIL 730 FS SOLVENT RESISTANT SEALANT

    • One-Component Sealing System
    • Room-Temperature Sealing Cure
    • Non-Sag Placement Control
  • DOWSIL Q4-2805 NON-CURING FLUOROSILICONE CHANNEL SEALANT

    DOWSIL Q4-2805 NON-CURING FLUOROSILICONE CHANNEL SEALANT

    • Aviation-Fuel, Fuel, and Oil Resistance
    • Non-Curing, Catalyst-Free Formulation
    • 55 to 200 deg C Service Range
  • DOWSIL 734

    DOWSIL 734

    • Self-Leveling Flowable Placement
    • 7-Minute Tack-Free Time
    • 17 kV/mm Dielectric Strength
  • DOWSIL 983

    DOWSIL 983

    • Two-Part Structural Glazing Silicone
    • +/-25% ASTM C719 Movement
    • 10 to 25-Minute Working Window
  • DOWSIL OS-20

    DOWSIL OS-20

    • Immersion, Spray, or Wipe Cleaning
    • Very-Low-Residue Complete Evaporation
    • 0 g/L US VOC-Exempt Solvent
  • DOWSIL RSN-0996

    DOWSIL RSN-0996

    • Motor/Coil/Transformer Impregnating Varnish
    • 150 deg C Minimum Cure Temperature
    • 1,626 V/mil Dielectric Strength
  • DOWSIL TC-5021

    DOWSIL TC-5021

    • One-Part Non-Curing Thermal Compound
    • 0.2 deg C cm^2/W Thermal Resistance
    • 82,650 cP Application Viscosity
  • DOWSIL™ 3-1598 HP Adhesive

    DOWSIL™ 3-1598 HP Adhesive

    • High strength
    • Low void
    • Self-leveling rheology
  • DOWSIL™ TC-4525 CV Thermally Conductive Gap Filler

    DOWSIL™ TC-4525 CV Thermally Conductive Gap Filler

    • Controlled silicone volatility (CV)
    • 2.5 W/m-K Thermal Conductivity
    • Applicable for Vertical Position
  • DOWSIL 732 MULTI-PURPOSE SEALANT

    DOWSIL 732 MULTI-PURPOSE SEALANT

    • One-Part Moisture-Cure Sealing
    • Thermal Stability for Sealing
    • Non-Sag Placement Control
  • DOWSIL Q4-2817 FLUOROSILICONE SEALANT

    DOWSIL Q4-2817 FLUOROSILICONE SEALANT

    • 55 to 260 deg C Service Range
    • Aviation-Fuel, Fuel, and Solvent Resistance
    • Aerospace Sealing Application
  • DOWSIL 736

    DOWSIL 736

    • Up to 260 deg C Continuous Service
    • Non-Slumping Vertical/Overhead Application
    • Flexible High-Temperature Silicone Sealing
  • DOWSIL DA6534

    DOWSIL DA6534

    • 6.8 W/(m K) Thermal Conductivity
    • Electrically Conductive Bonding
    • One-Part Heat-Cure Bonding
  • DOWSIL RSN-0997

    DOWSIL RSN-0997

    • Silicone Impregnating Resin for Windings
    • 90 to 120 cP Viscosity Range
    • 2,000 V/mil Dry Dielectric Strength
  • DOWSIL TC-5121C

    DOWSIL TC-5121C

    • 2.8 W/(m K) Thermal Interface
    • 0.09 deg C cm^2/W Thermal Resistance
    • One-Part, Non-Curing and Flowable Formulation
  • DOWSIL™ 3-1944 RTV Coating

    DOWSIL™ 3-1944 RTV Coating

    • One-part silicone coating, room-temperature curing
    • Low viscosity for complete wetting of complex geometries
    • Durable, flexible protective layer
  • DOWSIL™ TC-5026 Thermally Conductive Compound

    DOWSIL™ TC-5026 Thermally Conductive Compound

    • Ultra-thin bondline capability of approximately 0.007 mm
    • Suitable for CPU, GPU, MPU, ASIC, and processor
    • Flowable silicone compound
  • DOWSIL 738 ELECTRICAL SEALANT

    DOWSIL 738 ELECTRICAL SEALANT

    • One-Part Moisture-Cure Sealing
    • Non-Sag Placement Control
    • 500% Cured Elongation
  • DOWSIL SE 1700

    DOWSIL SE 1700

    • Two-Part Bonding System
    • Extended Working Time
    • Heat-Accelerated Bonding Cure
  • DOWSIL 737

    DOWSIL 737

    • One-Part Neutral-Cure Silicone
    • 3 to 6-Minute Skin-Over
    • Primerless Multi-Substrate Adhesion
  • DOWSIL SC102

    DOWSIL SC 102

    • Moderate Thermal-Conductivity Compound
    • One-Part Non-Curing Processing
    • Critical-Component Heat Transfer
  • DOWSIL TC-5351

    DOWSIL TC-5351

    • 3.3 W/(m K) Thermal Interface
    • Screen-Printable Thermal Interface
    • Vertical Gap-Fill Capability Up to 1.0 mm
  • DOWSIL™ TC-5533 Gap Filler

    DOWSIL™ TC-5533 Gap Filler

    • Designed specifically for EV battery module
    • Controlled siloxane volatility
    • Vertical Stability
  • DOWSIL 739 PLASTIC ADHESIVE

    DOWSIL 739 PLASTIC ADHESIVE

    • One-Part Adhesive System
    • Flame-Resistant Cured Adhesive
    • Non-Flowing Application Control
  • DOWSIL SE 9186 Sealant

    DOWSIL SE 9186 Sealant

    • Fast Room-Temperature Sealing Cure
    • Self-Leveling Flowable Placement
    • Controlled-Volatility Silicone Formulation
  • DOWSIL 748

    DOWSIL 748

    • Non-Corrosive Application Formulation
    • 15-Minute Tack-Free Time
    • 55 to 177 deg C Service Range
  • DOWSIL DS-2025

    DOWSIL DS-2025

    • Cured Silicone Residue Removal
    • Up to 400 g/L Silicone Solubilization
    • Below 10 cP Low Viscosity
  • DOWSIL SE1714

    DOWSIL SE1714

    • One-Part No-Mix Bonding
    • 30-Minute 150 deg C Cure
    • 1,030 psi Cured Tensile Strength
  • DOWSIL TC-5625C

    DOWSIL TC-5625C

    • One-Part Non-Curing Thermal Interface Compound
    • Thermally Conductive Thermal Interface
    • Screen, Stencil, or Dispense Application
  • DOWSIL™ TC-5550 Thermal Conductive Compound

    DOWSIL™ TC-5550 Thermal Conductive Compound

    • Good pump-out resistance for bare die application
    • High thixotropy
    • Low thermal resistance
  • DOWSIL 744 RTV SILICONE SEALANT

    DOWSIL 744 RTV SILICONE SEALANT

    • One-Part Moisture-Cure Sealing
    • 70 psi Cured Tensile Strength
    • Primerless Aluminum Bonding
  • DOWSIL TC-2030 THERMALLY CONDUCTIVE ADHESIVE

    DOWSIL TC-2030 THERMALLY CONDUCTIVE ADHESIVE

    • 2.7 W/(m K) Thermal Bonding
    • Two-Part Heat-Cure Adhesive
    • Electrical-Insulation Thermal Bonding
  • DOWSIL 3-6121

    DOWSIL 3-6121

    • Low-Temperature Use to -65 deg C
    • 275% Cured Elongation
    • 10-Minute 150 deg C Cure
  • DOWSIL 786

    DOWSIL 786

    • Mildew-Resistant High-Humidity Sanitary Sealant
    • Permanently Flexible Cured Seal
    • One-Part Non-Sag Application
  • DOWSIL EA6052

    DOWSIL EA6052

    • Temperature-Controlled Heat Cure
    • Five-Hour Working Window
    • UV Light Bonding Cure
  • DOWSIL SE1720

    DOWSIL SE 1720

    • 1:1 Controlled Mixing
    • 89,700 cP Mixed Viscosity
    • 50-Minute 70 deg C Cure
  • DOWSIL TC-5888

    DOWSIL TC-5888

    • Thixotropic Application Control
    • Thermally Conductive Thermal Interface
    • Microprocessor and Power-Module Thermal Interfaces
  • DOWSIL™ 3-6265 HP Adhesive

    DOWSIL™ 3-6265 HP Adhesive

    • One-part
    • Versatile heat cure
    • Non-flowing rheology
  • DOWSIL™ TC-5860 Thermally Conductive Compound

    DOWSIL™ TC-5860 Thermally Conductive Compound

    • High dielectric strength
    • 6.0 W/m-K Thermal Conductivity
    • Suitable for High Power Electronics
  • DOWSIL 866 PRIMERLESS SILICONE ADHESIVE

    DOWSIL 866 PRIMERLESS SILICONE ADHESIVE

    • Primerless Silicone Adhesion
    • Durable Silicone Formulation
    • EV/Automotive Component Assembly
  • DOWSIL TC-5622 THERMALLY CONDUCTIVE COMPOUND

    DOWSIL TC-5622 THERMALLY CONDUCTIVE COMPOUND

    • 4.3 W/(m K) Thermal Conductivity
    • 0.06 deg C cm^2/W Thermal Resistance
    • Non-Curing, Solventless Compound for Dispensing or Printing
  • DOWSIL 3-6548

    DOWSIL 3-6548

    • Fire-Resistant RTV Silicone Foam
    • 2x to 4x Liquid-Volume Expansion
    • Flexible Medium-Density Ozone/UV-Resistant Foam
  • DOWSIL 832

    DOWSIL 832

    • Primerless Multi-Substrate Adhesion
    • One-Part Low-Odor Neutral Cure
    • -55 to 149 deg C Service
  • DOWSIL EA9189-H

    DOWSIL EA9189-H

    • One-Part No-Mix Bonding
    • Tack-Free Time at 25 deg C
    • UL 94 V-0 Classification
  • DOWSIL X3-1598

    DOWSIL X3-1598

    • UV-Indicator Flowable Silicone Adhesive
    • 60-Minute 125 deg C Cure
    • Primerless Aluminum Bonding
  • DOWSIL™ 3-8259 RF Silicone Foam Dark Grey

    DOWSIL™ 3-8259 RF Silicone Foam

    • Two-part
    • Fast room temperature cure
    • Reduced flow rheology
  • DOWSIL™ TC-6010 Thermally Conductive Encapsulant

    DOWSIL™ TC-6010 Thermally Conductive Encapsulant

    • Flowable and self-leveling formulation
    • Excellent dielectric strength of 22 kV/mm
    • 1.2 W/m·K thermal conductivity
  • DOWSIL 93-104 Ablative Material Kit

    DOWSIL 93-104 Ablative Material Kit

    • Protects surfaces from direct flame and extreme heat exposure
    • Forms a tough char with less than 0.1 mm/s penetration
    • Supports brush, roll, trowel, or molded application methods
  • DOWSIL TC-8225 Thermally Conductive Gap Filler

    DOWSIL TC-8225 Thermally Conductive Gap Filler

    • 2.7 W/(m K) Thermal Interface
    • Soft, Compressible Silicone Gap Filler
    • Automated Dispensing Ready
  • DOWSIL 3-6559

    DOWSIL 3-6559

    • Adjustable 1 to 5 Wt% Addition Level
    • 4 to 12-Hour Cure Window
    • Surface/Environment Cure-Inhibition Management
  • DOWSIL 838

    DOWSIL 838

    • One-Part Moisture-Cure Application
    • Non-Sag Placement Control
    • Flexible Cured Material
  • DOWSIL EC-6601

    DOWSIL EC-6601

    • 86 dB 1 kHz to 8.5 GHz Shielding
    • 2.7E-3 ohm-cm Volume Resistivity
    • One-Part Room-Temperature Moisture Cure
  • DOWSIL PV-804

    DOWSIL PV-804

    • One-Part Neutral Alkoxy Silicone Sealant
    • 190 g/min Non-Slump Extrusion Rate
    • 620% Cured Elongation
  • DOWSIL SE4450

    DOWSIL SE 4450

    • 1.9 W/(m K) Thermal Bonding
    • Self-Leveling Flowable Placement
    • 6.7 MPa Aluminum Lap Shear
  • DOWSIL X3-6211

    DOWSIL X3-6211

    • Rapid UV Encapsulation Cure
    • 925 cP Application Viscosity
    • 17 kV/mm Dielectric Strength
  • DOWSIL™ 7091 Adhesive Sealant

    DOWSIL™ 7091 Adhesive Sealant

    • Non-sag rheology
    • One-part moisture cure
    • Stable and flexible from -40 to 180℃
  • DOWSIL™ TC-6040 Thermal Conductive Encapsulant

    DOWSIL™ TC-6040 Thermal Conductive Encapsulant

    • Heat accelerated cure
    • Room temperature cure
    • 4.0 W/m·K flowable silicone encapsulant
  • DOWSIL EA-2626

    DOWSIL EA-2626

    • Fast Adhesive Cure
    • Non-Sag Placement Control
    • Robust Cured Mechanical Properties
  • DOWSIL™ 3-1944HP RTV Coating

    DOWSIL™ 3-1944 HP RTV Coating

    • One-Part, Solventless Silicone Coating
    • 7-Minute Tack-Free Time
    • Integrated UV Indicator
  • DOWSIL 3-6751

    DOWSIL 3-6751

    • 1.0 W/(m K) Thermal Bonding
    • 9,300 cP Mixed Viscosity
    • 3.5 MPa Aluminum Lap Shear
  • DOWSIL 839

    DOWSIL 839

    • One-Part No-Mix Sealing
    • Non-Sag Placement Control
    • Electronics Assembly and Module Sealing
  • DOWSIL EG-4131

    DOWSIL EG-4131

    • Clear 1:1 Pdms Dielectric Gel
    • 650 cP Mixed Viscosity
    • 91.1% Transmission at 450 Nm
  • DOWSIL Q2-1346

    DOWSIL Q2-1346

    • Low Sodium and Potassium Impurity Limits
    • Clear Liquid Supplied Free from Suspended Matter
    • Long 900-Day Shelf Life
  • DOWSIL SE4485

    DOWSIL SE 4485

    • 2.8 W/(m K) Thermal Conductivity
    • One-Part Moisture-Cure Silicone
    • Thermal-Bonding Electrical Insulation
  • DOW XR-1541

    DOW XR-1541

    • E-Beam Patternable, Negative Tone
    • Etch Resistance Surface Treatment
    • High Purity Surface Treatment
  • DOWSIL™ 844 RTV Adhesive Sealant

    DOWSIL™ 844 RTV Adhesive Sealant

    • One-part moisture cure
    • Fast processing
    • Broad adhesion
  • DOWSIL 1-4173 THERMALLY CONDUCTIVE ADHESIVE

    DOWSIL 1-4173 THERMALLY CONDUCTIVE ADHESIVE

    • One-Part Heat-Cure Thermal Bonding
    • 1.8 W/(m K) Thermal Bonding
    • Primerless Thermal Bonding Processing
  • DOWSIL EA-6060 Adhesive

    DOWSIL EA-6060 Adhesive

    • Two-Part Adhesive System
    • Moderate Adhesive Cure
    • Broad Substrate Adhesion
  • DowSil 3-6077 RTV Silicone Ablative

    DowSil 3-6077 RTV Silicone Ablative

    • 0.035 mm/s Ablation Penetration Rate
    • 2 to 3-Hour Working Window
    • Spray or Trowel Application
  • DOWSIL 3-6752

    DOWSIL 3-6752

    • 1.8 W/(m K) Thermal Bonding
    • 3-Minute Cure Cycle
    • 3.8 MPa Aluminum Lap Shear
  • DOWSIL 90-006 RF

    DOWSIL 90-006 RF

    • Two-Hour Working Time at 25 deg C
    • Mixing, Loading, Dispensing, and Assembly Processing
    • Prepared/Primed Aerospace-Material Adhesion
  • DOWSIL FS1265

    DOWSIL FS1265

    • 100% Active Fluorosilicone Foam Control
    • Chlorinated-Solvent-Insoluble Foam-Control Formulation
    • 300/1,000/10,000 mm^2/s Viscosity Grades
  • DOWSIL Q2-3067

    DOWSIL Q2-3067

    • One-Part Grease-Like Optical Couplant
    • Fiber-Optic Assembly Applications
    • Above 101.1 deg C Flash Point
  • DOWSIL SE4486

    DOWSIL SE 4486

    • 1.6 W/(m K) Thermal Conductivity
    • Four-Minute Tack-Free Time
    • 1.65 MPa Lap Shear
  • DOWSIL 186

    SYLGARD 186

    • 10:1 Meter-Mix Processing
    • 255% Cured Elongation
    • 100 ppi Tear Strength
  • DOWSIL™ EA-4700 CV Adhesive

    DOWSIL™ EA-4700 CV Adhesive

    • Two-part system
    • Fast curing options
    • Controlled volatility
  • DOW SYLGARD 164 ENCAPSULANT

    SYLGARD™ 164 Silicone Elastomer Kit

    • Flowability for Different Processes
    • Fast Room-Temperature Encapsulation Cure
    • UL 94 V-0 Classification
  • DOWSIL EA-9187L UV Conformal Coating

    DOWSIL EA-9187L UV Conformal Coating

    • One-Part Solvent-Free Silicone Coating
    • Shore A 17 Hardness
    • 20 kV/mm Dielectric Strength
  • Dow XIAMETER PMX 200

    Dow XIAMETER PMX 200

    • 1,000 cSt Polydimethylsiloxane Fluid
    • Surface Tension of 21.2 dynes/cm
    • Dielectric Strength of 400 volts/mil
  • DOWSIL 3-6876

    DOWSIL 3-6876

    • Flowable One-Part Processing
    • 300-Minute 100 deg C Cure
    • Balanced Cured Mechanical Properties
  • DOWSIL 9-1363

    DOWSIL 9-1363

    • Fast Skin-Over and Tack-Free Development
    • Primerless Multi-Substrate Adhesion
    • Neutral-Cure Silicone Adhesive
  • DOWSIL Q3-6575

    DOWSIL Q3-6575

    • Clear 1:1 Dielectric Gel System
    • 750 cP Mixed Viscosity
    • Room-Temperature Encapsulation Cure
  • DOWSIL SE9120

    DOWSIL SE 9120

    • Ready-to-Dispense Flowable Silicone Sealant
    • Fast Tack-Free No-Mix Processing
    • Controlled-Volatility Electronics/Industrial Sealant
  • DOWSIL 282

    DOWSIL 282

    • High-Adhesion Tape Formulation
    • 55-57% Active Silicone Content
    • Cured-Film Electrical Insulation
  • DOWSIL 1200

    DOWSIL 1200

    • No-Mix Primer Application
    • RTV and Heat-Cure Silicone Adhesion
    • Glass, Ceramic, FR-4, and Metal Adhesion
  • DOWSIL 1201

    DOWSIL 1201

    • Adhesion-Promoting Surface Treatment
    • Low-Viscosity Adhesive Application
    • 1 to 2-Hour Cure Window
  • DOWSIL 3-6060

    DOWSIL 3-6060

    • Improved Inhibition Resistance
    • Promotes Bonding to Most Plastics
    • Wipe, Dip, or Spray Application
  • DOWSIL 92-023

    DOWSIL 92-023

    • Adhesion-Promoting Surface Treatment
    • Improved Inhibition Resistance in Addition-Cure Silicone Systems
    • 1 to 2-Hour Cure Window
  • DOWSIL DS-1000

    DOWSIL DS-1000

    • Silicone Oil/Grease/Elastomer Emulsification
    • Immersion, Recirculation, or Spray Cleaning
    • Above 100 deg C Flash Point
  • DOWSIL OS2

    DOWSIL OS-2

  • DOWSIL OS-30

    DOWSIL OS-30

    • Complete Low-Residue Room-Temperature Evaporation
    • Low-Surface-Tension Precision Cleaning
    • Most-Plastic and Coating Compatibility
  • DOWSIL P5200

    DOWSIL P5200

    • RTV and Heat-Cure Adhesion Promotion
    • Wipe, Dip, or Spray Application
    • 18-Month Shelf-Life Indicator
  • DOWSIL PR-2260 PRIME COAT CLEAR RTV SILICONE

    DOWSIL PR-2260 PRIME COAT CLEAR RTV SILICONE

    • Adhesion-Promoting Surface Treatment
    • Thin-Film Silane Primer
    • Electronics and Industrial Assembly Applications
  • DOWSIL PR1200

    DOWSIL PR1200

    • Adhesion-Promoting Surface Treatment
    • Wipe, Spray, or Dip Application
    • 1 to 2-Hour Cure Window
  • DOWSIL PR1204

    DOWSIL PR1204

    • Adhesion-Promoting Surface Treatment
    • Light, Even Application by Wiping, Dipping
    • Room-Temperature Adhesive Cure
  • DOWSIL PR4040

    DOWSIL PR4040

    • Adhesion-Promoting Surface Treatment
    • One-Part Surface Preparation System
    • Clear Primer Dispersed in Heptane
  • DOWSIL 3-4154 CLEAR DIELECTRIC GEL

    DOWSIL 3-4154 Dielectric Gel Kit

    • Electrically Insulating Material
    • 550 mPa s Mixed Viscosity
    • 180-Minute 80 deg C Cure
  • DOWSIL 3-4155

    DOWSIL 3-4155

    • 60-Minute Gel Window
    • Soft 60 G Gel for Dielectric Encapsulation
    • 65 to 200 deg C Service Range
  • DOWSIL 3-4222

    DOWSIL 3-4222

    • 30-Minute Cure Cycle
    • Visual 1:1 Mix Verification
    • 14 kV/mm Dielectric Strength
  • DOWSIL 3-4241

    DOWSIL 3-4241

    • Over One-Hour Working Time
    • Conditional Primerless Adhesion
    • 17 kV/mm Dielectric Strength
  • DOWSIL 3-4680

    DOWSIL 3-4680

    • Fast Room-Temperature Encapsulation Cure
    • Low-Viscosity Dispensing Control
    • Electrically Insulating Encapsulation
  • DOWSIL 3-6635 CLEAR DIELECTRIC GEL

    DOWSIL 3-6635 CLEAR DIELECTRIC GEL

    • 80 to 200 deg C Service Range
    • Ultra-Soft Dielectric Gel
    • 20 kV/mm Dielectric Strength
  • DOWSIL LPA-4000

    DOWSIL LPA-4000

    • One-Part Non-Slumping RTV Silicone
    • Spray, Trowel, Brush, or Roller Application
    • Thermally Conductive Coating
  • DOWSIL SE4445

    DOWSIL SE 4445

    • Two-Component Electronics Silicone System
    • White/Charcoal Component Identification
    • 2.4 Relative Density
  • DOWSIL™ 3-4150 Dielectric Gel Kit

    DOWSIL™ 3-4150 Dielectric Gel Kit

    • Low viscosity and room temperature cure gel
    • Low stress
    • Excellent dielectric performance
  • DOWSIL™ 3-4207 Dielectric Tough Gel Kit

    DOWSIL™ 3-4207 Dielectric Tough Gel Kit

    • Multiple cure schedule for flexible processing.
    • Translucent green with UV indicator support for automated inspection.
    • 59 Shore 00 toughened gel with UL 94 V-1 and EN 45545-2 R25 HL3 listed

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